Wafer/FPA Fab/Process Engineer jobs in United States
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Teledyne Technologies Incorporated ยท 1 week ago

Wafer/FPA Fab/Process Engineer

Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. They are seeking a Semiconductor wafer fab/process engineer for advanced IR detectors and focal plane arrays (FPAs) fab process development and production, working in a high growth, high technology environment.

ElectronicsEnergyManufacturingTelecommunications
badNo H1BnoteU.S. Citizen Onlynote

Responsibilities

Compound semiconductor wafer fabrication/processing
Photolithography
Wet and dry etchings
Thin film depositions, including metal and dielectric films
Wafer cleaning and surface passivation
Wafer polishing
Infrared focal plane array fabrication
Wafer fab/process metrology tests

Qualification

Semiconductor wafer fabricationPhotolithographyThin film depositionsWafer cleaningInfrared focal plane array fabricationWafer polishingAttention to detailsIndependent thinkingBasic computer proficiencyCommunication skills

Required

Experience and hands-on skills in semiconductor wafer fab and processing
Knowledge of semiconductor wafer processes and related chemicals
Attention to details and good observation
Independent thinking and working independently
Thrive for process improvement and high-quality processing
Good verbal, written and presentation communication skills
Basic computer proficiency using Microsoft Office
Displays exemplary ethics and business conduct and performs work cognizant of safe work practices
BS degree required
Due to the type of work at the facility and certain access restrictions, successful applicants must be a U.S. Citizen

Preferred

MS in chemistry, material sciences, applied physics, electrical engineering, etc. preferred
Experience in photonics/semiconductor packaging, as well as in semiconductor assembly processes, is a plus, such as die bonding, hybridization, wire-bonding, and assembly
Experience in semiconductor wafer fab/processing and/or manufacturing of infrared sensors or other photoelectronic components is a plus

Benefits

Excellent Health, Dental, Vision
Paid Vacation Time
Paid Sick Time
Life Insurance Benefits
Paid Holidays
401(k) Eligibility
Employee Stock Purchase Plan
Educational Tuition Reimbursement

Company

Teledyne Technologies Incorporated

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Teledyne Technologies is a leading provider of sophisticated electronic components, instruments & communications products, including defense electronics, data acquisition & communications equipment for airlines and business aircraft, monitoring and control instruments for industrial and environmental applications and components, and subsystems for wireless and satellite communications.

Funding

Current Stage
Public Company
Total Funding
unknown
1999-12-03IPO

Leadership Team

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George Bobb
President and Chief Executive Officer
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Anna Segobia Masters
Vice President & Deputy General Counsel
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Company data provided by crunchbase