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Raytheon · 1 day ago

Senior Principal Electro-Mechanical Engineer

Andover, MA

Full-time

Onsite

Senior Level, Lead/Staff

$124K/yr - $250K/yr

10+ years exp

Raytheon is committed to helping our nation and allies defend freedoms and deter aggression. They are seeking a Senior Principal Electro-Mechanical Engineer to develop advanced microelectronics packages and innovative solutions for future generation technologies. The role involves working with cross-functional teams and requires strong mechanical and electrical engineering skills.

Intellectual PropertyInternetWeb Hosting

No H1B

Security Clearance Required

U.S. Citizen Only

Responsibilities

Work with cross-functional hardware engineering teams to develop advanced microelectronics packages including 3DHI, 3D, and 2.5D (interposer + chiplets) and novel material and process solutions for RF, digital, mixed-signal, and photonics products

Leverage industry-leading manufacturing and novel materials to achieve new levels of electro-mechanical performance and reliability

Qualification

Electro-Mechanical EngineeringRF Circuit DesignMicroelectronics Packaging2D CAD Tools3D CAD ToolsSemiconductor ManufacturingThermal Management DesignGeometric DimensioningToleranceInterpersonal SkillsWritten CommunicationVerbal CommunicationTeam Leadership

Required

Typically requires a Bachelor's Degree in a Science, Technology, Engineering & Math (STEM) Field and a minimum of ten (10) or more years of relevant experience (An advanced STEM degree could count for 3 years of experience) with mechanical and electrical engineering design

Experience performing circuit layout design using 2D CAD tools

The ability to obtain and maintain a US security clearance. U.S. citizenship is required as only U.S. citizens are eligible for a security clearance

Preferred

A Master's degree or PhD. in a Science, Technology, Engineering & Math (STEM) Field

Experience in RF circuit design, including 3D EM simulation in HFSS or similar tools

Circuit layout design experience using 2D and 3D CAD tools (Cadence Virtuoso and/or Allegro/APD+)

Experience and familiarity with selection and oversight for semiconductor wafer processing and finishing (plating, bumping, dicing)

Design experience with 3D and 2.5D packaging, complex CAD/EDA software design workflows, and RF/Thermal/Digital co-design

Experience qualifying and implementing cutting edge materials, fabrication techniques, and understanding of relevant materials used in semiconductor manufacturing and packaging

Strong background in development, documentation, fabrication, assembly, and test/delivery of military/defense and/or commercial state-of-the-art electronic products

Experience with designing electronics for extreme environmental requirements and design constraints

Proficiency with 3D Mechanical CAD modeling and analysis tools (e.g., Solidworks, Creo)

Experience in Geometric Dimensioning and Tolerance analysis for drawings

Current DoD Secret level security clearance

Innovative attitude to apply towards research and development of new technologies

Excellent interpersonal and multi-tasking skills

Excellent written and verbal communication skills

Ability to work independently and in a team environment, including as a leader of small teams