Intern 2026: Research Scientist - Semiconductor jobs in United States
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IBM · 2 days ago

Intern 2026: Research Scientist - Semiconductor

positionCambridge, MA
timeInternship
remoteOnsite
seniorityIntern
workcardStart in 2026

IBM Research is dedicated to technology and its societal impact, and they are seeking an intern to contribute to new hardware design and applications in semiconductor technology. The role involves applying research skills in areas such as chip architecture, fabrication, and advanced packaging.

Business DevelopmentBusiness Information SystemsCRMData ManagementFoundational AISoftware
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Apply your research skills toward new hardware design and applications from state-of-the-art chip architecture, design, fabrication and test to advanced chip packaging

Qualification

Semiconductor fabricationDevice physicsChip packagingLithographyPlasma etchDevice simulationComputational materials scienceNovel film depositionWet chemical processesPolymer materialsComputational opticsSemiconductor test

Required

Expertise in one or more of these areas: Semiconductor or memory device fabrication
Lithography
Plasma Etch
Novel Film deposition and epitaxial growth
Wet chemical processes
Device physics
Chip Packaging and thermal management
Polymer materials
Computational materials science
Computational optics
Device simulation
Semiconductor test and characterization
Strong research background as evidenced by project or publication in semiconductor technology, materials science or allied fields

Preferred

Master's Degree
Prior publications in focus areas and/or internship experience

Company

IBM

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IBM is an IT technology and consulting firm providing computer hardware, software, infrastructure, and hosting services.
dateFounded in 1911
location
Armonk, New York, USA
people-size10001+ employees
web-link
http://www.ibm.com

H1B Sponsorship

IBM has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (3032)
2024 (3301)
2023 (2160)
2022 (1809)
2021 (1157)
2020 (2669)

Funding

Current Stage
Public Company
Total Funding
unknown
2011-01-14IPO

Leadership Team

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Alain Bénichou
Chief Executive Officer, IBM Greater China Group
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Alex Yang
CTO and Chief Architect

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