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Google · 1 day ago

Package Design Engineer

Sunnyvale, CA

Full-time

Onsite

Mid, Senior Level

$156K/yr - $229K/yr

4+ years exp

Google is a leading technology company that develops innovative solutions for its direct-to-consumer products. As a Chip Package Designer on the Silicon Integration team, you will develop advanced package substrate designs for machine learning chips and collaborate with various engineering teams to optimize performance and reliability.

AppsArtificial Intelligence (AI)Cloud StorageSearch EngineSEO

Growth Opportunities

H1B Sponsor Likely

Responsibilities

Manage physical package substrate design of large form-factor package for ML High-Performance Computers (HPCs)

Develop and implement the methodology and CAD flow for efficient substrate design and enhanced productivity

Manage and drive co-design initiatives across chip, package, and system levels, including securing production sign-off for package designs

Collaborate closely with SI/PI, Thermal, and Mechanical Engineering teams to refine and optimize product package designs, test vehicles, and mock-up designs for product feasibility

Define and document the requirements for the package substrate design and Bill of Materials (BOM)

Qualification

Chip package designCadence APDDesign automationPhysical verification flowScriptingMechanical drawingsDFMCross-functional collaboration

Required

Bachelor's degree in Mechanical, Material, Electrical Engineering, Technology, Science, a related field, or equivalent practical experience

4 years of experience in chip package substrate design using Cadence APD (Allegro Package Designer) or mentor expedition

Experience in chip package substrate layout, design verification, DFM and taping out for production

Experience in design automation and scripting

Preferred

Experience in large-scale 2.5D/3.5D advanced package design

Experience in working with cross-functional teams including chip design, SI/PI, and PCB design teams

Experience in physical verification flow (e.g., Layout Versus Schematic (LVS), Design Rule Checking (DRC), connectivity)

Experience with CAD for creating simple mechanical drawings, such as Package Outline Drawings (POD)

Ability to write scripts to customize elements of the cadence or mentor workflow

Benefits

Bonus

Equity

Benefits

Company

Google

Glassdoor4.4

Google specializes in internet-related services and products, including search, advertising, and software. It is a sub-organization of Alphabet.

Founded in 1998

Mountain View, California, USA

10001+ employees

https://www.google.com

H1B Sponsorship

Google has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)

Distribution of Different Job Fields Receiving Sponsorship

Represents job field similar to this job

Trends of Total Sponsorships

2025 (8763)

2024 (8872)

2023 (9682)

2022 (11626)

2021 (9109)

2020 (9785)

Funding

Current Stage

Public Company

Total Funding

$26.1M

Key Investors

Andy Bechtolsheim

2004-08-19IPO

1999-06-07Series Unknown· $25M

1998-11-01Angel· $1M

Leadership Team

Sundar Pichai

CEO

Thomas Kurian

CEO - Google Cloud

Recent News

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2025-10-04