Google · 4 weeks ago
SoC Silicon Top-Level Floorplan Engineer
Sunnyvale, CA, USA
Full-time
Onsite
Senior Level, Lead/Staff
$183K/yr - $271K/yr
10+ years expGoogle is a leader in technology and innovation, and they are seeking a SoC Silicon Top-Level Floorplan Engineer to drive cutting-edge TPU technology for AI/ML applications. The role involves creating the initial physical layout of a chip, defining block sizing and placement, and collaborating with various teams to ensure performance and efficiency in chip design.
AppsArtificial Intelligence (AI)Cloud StorageSearch EngineSEO
Responsibilities
Own the planning, creation, and delivery of top-level floorplan deliverables and implementation for Silicon SOC projects from concept to working silicon volume
Resolve structural or physical issues related to the integration of complex ASICs and SoCs and collaborate with teams across Google to develop ideas for high impact Silicon and Hardware projects
Manage all cross-functional interactions related to top-level floorplanning of chip projects
Develop and improve floorplan implementation methodologies. Support and execute implementation flows using both industry-standard and specialized internal tools
Perform technical evaluations of vendors and IP, providing recommendations and assessment of process node tradeoffs to meet performance, power, area and cost goals
Qualification
Required
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience
10 years of experience in physical design (e.g., with a focus on floorplanning, integration, or top-level chip assembly)
Experience in physical design working on advanced nodes
Experience collaborating with cross-functional teams (e.g., architecture, RTL design, synthesis, verification)
3D IC design experience (e.g., multi-die partitioning, TSV planning, advanced chiplet and packaging technologies, optimizing PPA, and physical verification in a System-in-Package context)
Preferred
Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture
Experience in scripting languages (e.g., Python, Tcl or Perl) and industry standard top-level tools including Innovus, FusionCompiler
Experience working on various technologies (e.g., embedded processors, DDR, SerDes, HBM, networking-on-chip fabrics, etc.)
Experience using specialized EDA tools to resolve DRC/LVS/EMIR issues for leading edge nodes
Experience with SoC design methodologies for full chip power grid, global clocking, data path implementation, 3PIP integration, and bump planning
Benefits
Bonus
Equity
Benefits
Company
Google specializes in internet-related services and products, including search, advertising, and software. It is a sub-organization of Alphabet.
10001+ employees
H1B Sponsorship
Google has a track record of offering H1B sponsorships. Please note that this does not
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reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
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Trends of Total Sponsorships
2025 (8763)
2024 (8872)
2023 (9682)
2022 (11626)
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2020 (9785)
Funding
Current Stage
Public CompanyTotal Funding
$26.1MKey Investors
Andy Bechtolsheim
2004-08-19IPO
1999-06-07Series Unknown· $25M
1998-11-01Angel· $1M
Leadership Team
Sundar Pichai
CEO
Thomas Kurian
CEO - Google Cloud
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