Qualcomm · 6 hours ago
Hardware Design Engineer - Sr Staff
Austin, TX
Full-time
Onsite
Senior Level, Lead/Staff
$146K/yr - $244K/yr
6+ years expQualcomm Technologies, Inc. is a leader in hardware engineering focused on AI solutions for data centers. The role involves designing and developing advanced hardware systems, collaborating with cross-functional teams, and ensuring the successful integration and performance of rack-level AI products.
Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
Responsibilities
Lead schematics design, PCB layouts, design reviews, component selections, mechanical and thermal designs, and develop test plans
Co-develop functional specifications for systems, cards, sub-systems, and rack-level architectures
Collaborate with internal teams and ODMs to develop and support customer-specific hardware and system requirements
Facilitate consensus on technical trade-offs at hardware, software, and chip design levels
Support architecture and card designs including accelerator SoCs, memory, I/O, power delivery, electrical/mechanical integration, and PCB definition/design
Participate in the design and development of rack-level inference solutions, ensuring alignment with customer requirements and system-level performance goals
Resolve architecture and design issues across system, card, and rack levels
Assist in the bring-up and debugging of hardware systems, cards, and rack-level configurations
Provide technical oversight of factory and manufacturing processes, ensuring quality and consistency across rack-level deployments
Contribute to writing Statements of Work (SOWs) and ODM product requirements; drive technical milestones and deliverables
Coordinate across multiple development sites, including Qualcomm locations and ODM/JDM partners in Taiwan and internationally
Travel to development and customer sites as needed to support rack-level solution deployment and validation
Influence and communicate technical recommendations across disciplines and geographic locations
Coordinate and deliver technical training for ODMs, with a focus on rack-level system integration and deployment
Qualification
Required
System/card/rack-level development, including architecture, design, validation, and deployment of enterprise-class hardware platforms
Proven experience in rack-level system integration, including chassis, backplane, cabling, airflow, and thermal management across multiple cards/modules
Familiarity with rack-scale power delivery, including PDUs, VRMs, PMICs, and power budgeting across multiple boards
Experience with rack-level diagnostics and bring-up, including debug of interconnects, signal integrity across long traces/cables, and system-level validation
Understanding of rack-level mechanical constraints, EMI shielding, and compliance with data center deployment standards
Collaboration with ODMs/OEMs on rack-level design and manufacturing, including review of mechanical drawings, thermal simulations, and compliance testing
Deep knowledge of PCIe cards, motherboards, daughtercards, and backplane signal and power delivery
Expertise in chassis design, airflow optimization, and thermal management
Solid understanding of system software operation from bootloader to OS and application layers
Experience qualifying PMICs, voltage regulators (VRs), clock buffers, flash memory, and connectors for use in complex card and rack-level designs
Hands-on experience in dense, high-layer count PCB designs (8–20+ layers)
Skilled in PCIe add-in card/module design, debugging in high-performance systems (x86 and ARM)
Familiarity with JTAG tools for bring-up and debug
Experience with networking switches and high speed ethernet interfaces
Knowledge of high-speed serial I/O (6–10+ Gbps), PCIe Gen5/6, LPDDR4x/5x, DDR4/5, 200/400/800 GbE
Experience with long PCB/cable topologies (0.35–1.5 meter), signal integrity, and compliance with current standards
Ability to debug at packet/protocol level across link, transport, transaction, and command layers
Experience with LPDDR4x memory technologies, DIMM layout and validation
Expertise in clock distribution, power distribution, SMBus, PMBus, SPI, PWM/Tach, and BMC integration
Proficient in schematic capture and PCB layout tools (Cadence Allegro, Mentor Expedition)
Experience with circuit simulation tools (SPICE), signal/power integrity analysis
Skilled in using lab equipment: oscilloscopes, logic analyzers, JTAG, SMBus, serial debuggers
Strong collaboration with ODMs on joint designs, schematic/layout reviews, and compliance to Qualcomm design guidelines
Good understanding of x86 FW/SW stack and firmware architecture
Experience with BMC hardware/software integration and management
Familiarity with regulatory, environmental, and compliance testing for rack-level systems
Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience
Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience
PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience
Preferred
Master's Degree in Electrical and Electronic Engineering, Computer Engineering, or related field
10+ years hardware engineering/Systems development experience or related work experience
4+ years of experience with circuit design (e.g., digital, analog, RF)
4+ years of experience utilizing schematic capture and circuit simulation software
4+ years of experience with hardware design and measurement instruments such as oscilloscopes, spectrum analyzers, debug tools, etc
Benefits
Competitive annual discretionary bonus program
Opportunity for annual RSU grants
Highly competitive benefits package
Company
Qualcomm
Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.
10001+ employees
H1B Sponsorship
Qualcomm has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2013)
2024 (1910)
2023 (3216)
2022 (2885)
2021 (2104)
2020 (1181)
Funding
Current Stage
Public CompanyTotal Funding
$3.5M1991-12-20IPO
1988-01-01Undisclosed· $3.5M
Leadership Team
Cristiano Amon
President and Chief Executive Officer
I
Isaac Eteminan
CEO
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