Lincoln Electric · 3 days ago
FPGA Engineer
Euclid, OH
Full-time
Onsite
Mid, Senior Level
$106K/yr - $124K/yr
5+ years expLincoln Electric is the world leader in engineering and manufacturing advanced welding solutions. They are seeking a highly capable FPGA Design Engineer to focus on the architecture, design, and implementation of FPGA-based systems for embedded and high-performance applications.
Electrical DistributionManufacturingRobotics
Responsibilities
Develop and maintain VHDL-based designs for control, signal processing, and communication subsystems
Architect modular and reusable IP blocks for integration into complex FPGA systems
Collaborate with hardware and software engineers to define functional requirements and partition logic between hardware, firmware, and software
Perform static timing analysis and achieve timing closure across multiple clock domains
Optimize designs for performance, area, and power using synthesis and place-and-route tools
Debug timing violations and implement constraints using industry-standard tools
Design and implement AXI-based interfaces to ARM processors and other embedded subsystems
Integrate FPGA logic with SoC platforms and manage data flow between programmable logic and software
Support development of device drivers and firmware for FPGA-accelerated functions
Develop testbenches and simulation environments using VHDL
Perform functional and formal verification of FPGA designs
Support hardware bring-up and lab testing using logic analyzers, oscilloscopes, and JTAG tools
Work closely with embedded software, hardware, and systems teams to ensure seamless integration
Participate in design reviews and contribute to system-level architecture decisions
Document design specifications, test results, and performance metrics
Stay current with FPGA technologies, high-level synthesis, and hardware acceleration trends
Evaluate new tools, platforms, and methodologies to improve design efficiency and reliability
Qualification
Required
Bachelor's degree in Electrical Engineering, Computer Engineering, or related field
Level III: 5+ years of relevant experience
Works independently: receives minimal guidance
May lead projects or project steps within a broader project or have accountability for ongoing activities or objectives
Level IV: 8+ years of relevant experience
Recognized as an expert in own area within the organization
Works independently, with guidance in only the most complex situations
3+ years of experience in FPGA design and development using VHDL
Proficiency with AMD/Xilinx, Intel/Altera, and/or Microchip/Microsemi FPGA platforms
Strong understanding of timing analysis, constraints, and closure techniques
Experience with AXI interconnects and integration with ARM-based processing systems
Familiarity with simulation and verification tools such as VUnit or Vivado Simulator
Hands-on experience with lab equipment such as oscilloscopes and logic analyzers
Excellent problem-solving skills and ability to work in cross-functional teams
Strong written and verbal communication skills
Preferred
Experience with high-speed interfaces (e.g. PCI, Ethernet, DDR)
Knowledge of High-Level Synthesis tools
Familiarity with embedded Linux and device driver development
Understanding of security implications within FPGA-based embedded systems
Experience with FPGA-based control systems and digital signal processing
Benefits
Bonus Plan: AIP AIP
Target Bonus: Level III-10%; Level IV - 15%
Company
Lincoln Electric
Lincoln Electric is a manufacturer of welding products, arc welding equipment, and welding consumables.
10001+ employees
H1B Sponsorship
Lincoln Electric has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (1)
2024 (3)
2023 (2)
2022 (3)
2020 (3)
Funding
Current Stage
Public CompanyTotal Funding
$1.55B2024-06-24Post Ipo Debt· $1.55B
1995-06-23IPO
Leadership Team
Steven Hedlund
Chief Operating Officer
Geoffrey Allman
Senior Vice President, Acquisition Integration
Recent News
2025-10-31
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2025-10-31
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