Texas Instruments · 1 day ago
Manufacturing Product Engineer (LFAB)
Lehi, UT
Full-time
Onsite
Senior Level
5+ years expTexas Instruments is a global semiconductor company at the forefront of growth and innovation in semiconductor manufacturing. They are seeking experienced Product Engineers to optimize production yields, support new product launches, and drive continuous improvement initiatives within their state-of-the-art manufacturing facilities.
ComputerDSPSemiconductor
Responsibilities
Yield Optimization: Conduct thorough analysis of production yield issues to identify root causes and implement corrective actions that enhance product performance and manufacturing efficiency
New Product Launch: Collaborate with Business Units to characterize, qualify, and successfully release new products to production, ensuring a smooth transition from design to manufacturing
Production Support: Address daily production challenges including low yield disposition and process troubleshooting
Continuous Improvement: Lead initiatives focused on productivity, cost reduction, and quality enhancement across the production process
Data-Driven Insights: Utilize statistical tools and production data to guide engineering decisions and process improvements
Design Collaboration: Work with design teams on product simulation, design verification and silicon debug
Cross-functional Collaboration: Liaise with business units' product engineering teams to drive yield improvements through test program optimization, hardware enhancements, and setup adjustments
Qualification
Required
Master's degree in Electrical & Computer Engineering, Electrical Engineering, or related engineering degree
Minimum of 5 years of experience in a product engineering role within the semiconductor industry
Strong analytical skills and experience with yield analysis and manufacturing data
Proficiency in tools such as JMP, Excel, and statistical analysis software
Excellent communication and collaboration skills
Ability to work independently and in cross-functional teams
Preferred
Expertise in analog/mixed-signal circuit design, analysis, and verification, including experience with Operational Amplifiers (OP Amps), Analog-to-Digital Converters (ADCs), Digital-to-Analog Converters (DACs), and Radio Frequency (RF) circuits
Experience with digital logic design and verification, including Automatic Test Pattern Generation (ATPG) and scan chain design and implementation
Knowledge of memory design and architecture, including Static Random-Access Memory (SRAM) and Flash memory
In-depth knowledge of semiconductor manufacturing processes, including fabrication, assembly, and test
Strong foundation in device physics and circuit theory
Excellent collaboration and teamwork skills, with ability to work effectively across modules
Proven ability to drive results, prioritize tasks, and manage time to meet project deadlines
Adaptability and resilience in a fast-paced, dynamic environment with multiple priorities and interruptions
Strong interpersonal and influencing skills, with ability to build effective relationships and communicate with diverse stakeholders
Exceptional problem-solving skills, with attention to detail and ability to think creatively
Effective communication and presentation skills, with ability to articulate complex technical concepts to both technical and non-technical audiences
Strategic thinking and ability to navigate complex, high-pressure situations with poise and professionalism
Benefits
Competitive pay and benefits designed to help you and your family live your best life
Company
Texas Instruments
Texas Instruments is a global semiconductor company that manufactures, designs, tests, and sells embedded and analog processing chips.
10001+ employees
H1B Sponsorship
Texas Instruments has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (189)
2024 (184)
2023 (148)
2022 (222)
2021 (165)
2020 (179)
Funding
Current Stage
Public CompanyTotal Funding
$13.61BKey Investors
U.S. Department of Commerce
2025-05-20Post Ipo Debt· $1.2B
2024-12-20Grant· $1.61B
2024-05-28Post Ipo Equity· $2.5B
Leadership Team
Richard Templeton
President and Chief Executive Officer
Krunali Patel
Senior vice president and chief information officer
Recent News
2026-01-06
Company data provided by crunchbase