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AMD · 8 hours ago

Thermal Mechanical Engineer - Icepak/CFD

Secaucus, NJ

Full-time

Onsite

Mid, Senior Level

$132K/yr - $198K/yr

AMD is a company focused on building products that enhance next-generation computing experiences. The Thermal Mechanical Engineer will be responsible for the thermal design and validation for AMD's Data Center GPU products, collaborating with various engineering teams to deliver innovative thermal solutions.

AI InfrastructureArtificial Intelligence (AI)Cloud ComputingComputerEmbedded SystemsGPUHardwareSemiconductor

Growth Opportunities

No H1B

Responsibilities

Design thermal solutions to enable AMD's next generation of Datacenter GPUs

Collaborate with silicon design engineering, board engineering, power engineering and other cross-functional teams to design thermal-mechanical solutions from chip level to system level

Contribute to the overall product cycle from conceptualization through mass production

Work in a dynamic and fast-paced product development environment

Thermal validation of thermal-mechanical hardware at chip, card and system level

Identify and investigate novel thermal technologies and work with vendors and internal teams to evaluate the technologies for alignment to the AMD product roadmap

Drive process improvements while executing fast time-to-market on products

Qualification

Heat transferFluid dynamicsCFD experienceSolidWorksCreoThermal management designLiquid cooling solutionsData analysisProgramming skillsCommunication skills

Required

Strong background in heat transfer and fluid dynamics with emphasis on electronics thermal management

Thorough understanding of electronics cooling technologies; Air cooling and liquid cooling

CFD - Experience with CFD for liquid cooled systems with Icepak or similar tools is required

CAD - Experience with SolidWorks and/or Creo is required

Deep understanding of thermal management design elements including TIM, spreaders, heat sink, vapor chamber, heat pipe, and fan

Rack level and Datacenter and server level design experience

Experience developing liquid cooling solutions including design of cold plates, liquid interconnects, implementing quick disconnects, hoses, and manifolds

Excellent verbal and written communication skills at the engineering and executive levels, including a proven track record of working across organization boundaries to define requirements, solve complex problems and drive programs to successful completion

MS, Mechanical Engineering