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Atomica · 2 weeks ago

Senior Bonding Process Engineer

Goleta, CA

Full-time

Onsite

Mid, Senior Level

$90K/yr - $140K/yr

3+ years exp

Atomica is a company focused on developing technologies that empower innovations through MEMS. They are seeking a Senior Bonding Process Engineer to develop and sustain wafer bonding and alignment processes critical for MEMS device integration, collaborating closely with various engineering and R&D teams.

Autonomous VehiclesBiotechnologyCloud ComputingGeneticsMedicalOptical CommunicationSemiconductorSensorTherapeutics

No H1B

U.S. Citizen Only

Responsibilities

Develop, optimize, and sustain wafer bonding processes including anodic, fusion, direct, eutectic, and adhesive bonding for MEMS devices

Lead development and control of wafer alignment processes prior to bonding using high-precision alignment tools (e.g., SUSS MA/BA tools)

Ensure bonding alignment accuracy meets MEMS device requirements by evaluating alignment tolerances and bonding-induced shifts

Characterize bonding interface quality and alignment success using IR microscopy, acoustic microscopy, SEM, and other metrology tools

Perform root cause analysis and corrective actions for bonding and alignment failures or deviations

Design and execute DOEs for alignment and bonding process optimization

Work with equipment engineering on tool qualifications, recipe development, and preventive maintenance

Create and maintain process documentation including SOPs, specifications, control plans, and FMEAs

Support continuous improvement initiatives in yield, reliability, and throughput

Qualification

Wafer bondingPrecision alignmentMEMS process integrationData analysisBonding interface mechanismsWafer-level metrologySOP documentationRoot cause analysisContinuous improvementTeam collaboration