ElectroMechanical Packaging Engineer II jobs in United States
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Lockheed Martin · 1 month ago

ElectroMechanical Packaging Engineer II

Lockheed Martin is seeking an experienced Electronics Packaging Engineer for their Fleet Ballistic Missile Avionics team. The role involves developing preliminary 3D concept models of space flight avionics hardware and coordinating various analyses to ensure compliant designs while working within an Integrated Product Team environment.

AerospaceCyber SecurityMachinery ManufacturingMilitaryNational SecurityRemote SensingSecurity
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Growth Opportunities
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Responsibilities

Support trade studies on electronic enclosure design approaches and will provide technical data for informal and formal design review documentation and presentations
You will coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs
You will support manufacturing and test disciplines in minimizing cycle time and resolving electronic packaging problems
You will establish specifications for contract assemblers and raw-material vendors
You will interface with Parts Engineering, Quality Assurance and Purchasing regarding material quality and vendor performance
Provide producible designs that meet technical, cost, and schedule requirements, and work within an Integrated Product Team environment
Prepare all applicable drawings and documentation needed for the fabrication and assembly of the hardware designed
Identify initial physical architecture for the Avionics subsystem
Assist with R&D trade studies for Pre-SRR design phase
Assist with defining the requirements and provide the framework for architecture and interface development & maintenance throughout the program lifecycle
Generate and release design disclosure artifacts including technical presentations and end of year reports
Work on a cross-functional team in the development and integration of world class avionics systems
Develop electronic enclosure designs, performance and test requirements, and stress and thermal analysis
Participate in iterative design reviews, Engineering Material Review Board (EMRB) hardware discrepancy decisions and Failure Review Board (FRB) as required
Resolve test anomalies and support system level testing

Qualification

CCA package design3D printing/prototypingMissile/Aerospace experienceEPDM toolsDFx PrinciplesMicrosoft OfficeQNotes (SAP/ERP)Hands-on hardware experienceCommunication skillsTeam collaboration

Required

1+ years professional experience
US Citizenship is required

Preferred

Experience with CCA package design (IDX files, board outlines, connector selection, artwork review, component mounting, cooling techniques)
Working knowledge EPDM tools or equivalent
Exposure to DFx Principles (Design for Affordability, Design for Manufacturability, etc.)
Experience with 3D printing/prototyping
Missile/Aerospace related experience
Proficiency in Microsoft Office Software (Word, Excel, MS Project, PowerPoint)
Familiarity with FBM specifications/procedures
Familiarity and experience partnering with SP/SPF Customer Partners
Experience with QNotes (SAP/ERP), PMP Database, FAST Items, DaSI, and FBM Web (Livelink)
Previous MRB experience
Ability to communicate issues and additional resource needs to leadership
Experience with subcontracted hardware suppliers
Experience performing tolerance stack-ups
Demonstrated ability to collaborate effectively within a team environment and with adjacent disciplines
Excellent communication, presentation and interpersonal skills with technical and non-technical audiences including design reviews (SRR, PDR, CDR, etc.)
Hands-on hardware experience

Benefits

Lockheed Martin’s Comprehensive Benefits Package

Company

Lockheed Martin

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Lockheed Martin is a global security and aerospace company that specializes in advanced technology systems, products, and services. It is a sub-organization of Lockheed Martin.

Funding

Current Stage
Public Company
Total Funding
$6.06B
Key Investors
Air Force Research Laboratory
2025-12-05Post Ipo Debt· $3B
2025-08-28Post Ipo Debt· $3B
2023-11-13Grant· $33.7M

Leadership Team

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Jim Taiclet
Chairman, President & CEO
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Craig Martell
Chief Technology Officer
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Company data provided by crunchbase