Hewlett Packard Enterprise · 3 weeks ago
Principal Interconnect Development Engineer
San Jose, California, United States of America
Full-time
Hybrid
Lead/Staff
$154K/yr - $310K/yr
15+ years expHewlett Packard Enterprise is the global edge-to-cloud company advancing the way people live and work. This role is an individual contributor position responsible for high-speed interconnect solutions for next-generation network switches and routers, requiring dense, state-of-the-art frequency performance and quality.
Data CenterEnterprise SoftwareInformation TechnologyIT ManagementNetwork Security
Responsibilities
Works as the key development engineer positioned between hardware design engineering and interconnect suppliers, managing and influencing interconnect technology roadmaps
Works on interconnect technologies that are ‘pre-NPI’ or ‘pre-product’, to validate that future interconnect technologies are viable for system level designs that may be 2-5 years away from realization. Provides technical consultation support for interconnect component engineering, for NPI launch and interconnect activities
Responsible for development and execution of key interconnect technology validation plans, including the design and implementation of test vehicles to validate mechanical and signal integrity (SI) elements
Works with Interconnect suppliers and hardware engineering on key co-development projects, and design-related problem solving. Able to influence both internal and external stakeholders to drive design-related changes as needed. Able to impact suppliers, both technically as well as commercially
Provide persuasive understanding of trade-offs between mechanical design, SI, FMEA, failure analysis (electrical, physical, analytical, schematic), DOE and simulation versus reality/measurements
Qualification
Required
Demonstrated industry expertise: industry consortium participation and leadership, patents, published technical papers, and conference presentations. Lead and influence stakeholders in the Interconnect industry
Cross-functional expertise with hardware engineering, mechanical engineering, PCB, electrical (ex: SI), thermal engineering, program management, commodity (commercial) management and mechanical (stamping, molding), as well as other interconnect-adjacent technologies
Be current with industry trends and able to provide a compelling and attainable vision for five years out
Sophisticated knowledge of variation statistics and process control as relates to sound design and manufacturability of new connectors, including measures for successful first-pass design-in into native and partner NPI environments
Expert familiarity with industry standards for qualification and reliability
Presentation skills, communication skills, influencing skills
Deep industry experience (15 years), including 10 years of hands-on proficiency with high-speed, complex interconnect (≥56 GHz, ≥100 differential pairs) hardware…and successful field deployment
Experience must include both connectors AND high-speed cables, as well as interconnect materials and mechanical/electrical trade-offs
3D CAD modeling experience and geometric tolerance analysis abilities. Ex: tools = SolidWorks, ProE or other equivalent tools
BS, MS or PhD in Mechanical Engineering or equivalent
Benefits
Health & Wellbeing
Personal & Professional Development
Unconditional Inclusion
Company
Hewlett Packard Enterprise
Hewlett Packard Enterprise is an edge-to-cloud company that uses comprehensive solutions to accelerate business outcomes.
10001+ employees
H1B Sponsorship
Hewlett Packard Enterprise has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (532)
2024 (585)
2023 (591)
2022 (523)
2021 (551)
2020 (398)
Funding
Current Stage
Public CompanyTotal Funding
$2.85BKey Investors
Elliott Management Corp.
2025-04-15Post Ipo Equity· $1.5B
2024-09-10Post Ipo Equity· $1.35B
2015-11-02IPO
Leadership Team
Antonio Neri
President & CEO
Fidelma Russo
EVP & GM, Hybrid Cloud and Chief Technology Officer
Recent News
2026-01-11
2026-01-09
2026-01-09
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