Fab Process Engineer jobs in United States
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Broadcom · 7 hours ago

Fab Process Engineer

Broadcom is a leading technology company specializing in fiber optic communication products. The Fab Process Engineer will develop, improve, and sustain wafer fab processes for high volume manufacturing, ensuring robust equipment and process solutions are installed through rigorous characterization and statistical validation.

MobileSemiconductorWireless
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H1B Sponsor Likelynote

Responsibilities

Developing, improving, and sustaining wafer fab processes including photolithography, RIE/ICP dry etch, wet etch and thin film deposition processes for high volume photonic integrated circuit manufacturing
Conducting data analysis, failure analysis, and yield improvement
Conduct design of experiments, lead/take ownership of projects to develop/qualify new processes and tools, and complete projects on time and within budget
Maintaining or defining process standard operating procedures, providing instructions to operators for wafer processing
Maintaining or defining quality management standard including creating and reviewing SPC charts for robust quality control
Maintain a working knowledge of safety policies and regulations to ensure duties of self and others are performed in a safe manner
Collaborate with peers and process engineering/maintenance teams to define project scope, objectives, schedules, and resource requirements
Lead and manage long-term improvement projects to ensure timely execution and alignment with organizational goals

Qualification

Wafer fabrication experienceRIE/ICP dry etchThin film depositionPhotolithographyMaterial characterization methodsSPCDOELean manufacturing methodsSEM/EDS experienceAutomation solutionsProblem solvingTeamworkCommunication skills

Required

Bachelors in Physics, Electrical/Chemical/Material/Mechanical engineering with 8+ years of related experience; Masters with 6+ years of related experience; or PhD with 3+ years of related industry experience
Hands-on semiconductor wafer fabrication experience, preferably from a InP semiconductor production environment or compound semiconductor manufacturing environment
Direct experience in RIE/ICP, wet chemistry, thin film deposition, photolithography
Familiar with material & process characterization methods
Experience in using SPC, DOE and Lean manufacturing methods
Strong problem solving, teamwork, and communication skills
Being able to work outside of normal business hours when needed
Strong background in scaling high-volume manufacturing and implementing automation solutions

Preferred

Hands on SEM/EDS experience a plus
JMP experience a plus

Benefits

Medical, dental and vision plans
401(K) participation including company matching
Employee Stock Purchase Program (ESPP)
Employee Assistance Program (EAP)
Company paid holidays
Paid sick leave and vacation time
Paid Family Leave and other leaves of absence

Company

Broadcom

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Broadcom is a designer, developer, and global supplier of a broad range of analog and digital semiconductor connectivity solutions.

H1B Sponsorship

Broadcom has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (92)
2024 (77)
2023 (79)
2022 (112)
2021 (110)
2020 (89)

Funding

Current Stage
Public Company
Total Funding
unknown
2017-10-31Post Ipo Equity
2015-05-28Acquired
1998-04-17IPO

Leadership Team

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Greg Singh
CTO for APJ, Enterprise Security Group
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Kirsten Spears
CFO and CAO, Broadcom
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Company data provided by crunchbase