Teledyne Technologies Incorporated · 1 day ago
Senior Packaging Engineer
Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. The Senior Packaging Engineer will lead packaging design initiatives, ensuring products meet stringent reliability standards while driving innovation in integrated circuit packaging.
ElectronicsEnergyManufacturingTelecommunications
Responsibilities
Lead the design and development of new integrated circuit packages (plastic, ceramic, hybrid)
Translate customer requirements into optimized packaging solutions
Collaborate with production and marketing teams to ensure feasibility and cost-effectiveness
Assess and negotiate design trade-offs with customers and internal teams
Research technology trends and recommend improvements for high-reliability applications
Review and generate mechanical drawings for custom and standard packages
Interface with customers and suppliers to represent Teledyne with authority and expertise
Maintain knowledge of MIL-STD 883 and 1835 standards and apply them to designs
Qualification
Required
Strong knowledge of semiconductor electronics and IC packaging
Master's degree in engineering or equivalent experience (8+ years)
Familiarity with packaging materials and high-reliability applications
Ability to work independently and on-site
US citizenship and valid passport
Ability to travel up to 10% domestically and internationally
Preferred
Experience in aerospace and defense segment
MIL-STD 883 and 1835 experience
Benefits
Opportunity to work on advanced aerospace and defense technologies.
Collaborative team environment with strong technical leadership.
Competitive compensation and benefits package.
Company
Teledyne Technologies Incorporated
Teledyne Technologies is a leading provider of sophisticated electronic components, instruments & communications products, including defense electronics, data acquisition & communications equipment for airlines and business aircraft, monitoring and control instruments for industrial and environmental applications and components, and subsystems for wireless and satellite communications.
Funding
Current Stage
Public CompanyTotal Funding
unknown1999-12-03IPO
Leadership Team
Recent News
2026-01-05
2025-12-24
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