Neurophos · 3 weeks ago
VP of Product Engineering - Silicon Photonics
Austin, TX
Full-time
Onsite
Director/Executive
15+ years expNeurophos is a pioneering company revolutionizing AI computation with a metamaterial-based optical computing platform. They are seeking a VP of Product Engineering to lead the establishment and scaling of their product engineering organization, focusing on solving technological challenges in photonic AI modules and ensuring seamless transitions from R&D prototypes to high-volume production.
Artificial Intelligence (AI)Hardware
Hiring Manager
Logan Pirkl-Demarest
Responsibilities
Build and lead a world-class product engineering team from the ground up, including recruiting top talent in IC and photonics assembly, characterization, thermal/mechanical design, and reliability engineering; while personally contributing hands-on technical guidance to foster a collaborative, innovative culture aligned with Neurophos' mission to accelerate AI hardware
Establish and manage strategic partnerships with foundries, OSATs, and module assembly partners, negotiating contracts, overseeing qualifications, and ensuring supply chain resilience for high-volume photonic module production
Define, architect, and oversee IC assembly and integration, with a focus on co-packaged optics (CPO) architectures, including vertical integration, signal integrity, thermal design, and hybrid integration of metasurfaces, photonic integrated circuits, and photodetectors to achieve optimal performance and yield
Lead thermal design efforts for photonic modules, utilizing simulation tools (e.g., ANSYS, COMSOL) to model heat dissipation in high-power AI compute environments, identifying materials and structures for efficient thermal conduction, optimizing cooling solutions for copackaged modules, and ensuring reliability under hyperscaler workloads
Design and deploy active-alignment tools and processes, as well as optical and electrical calibration equipment on-site and at our module assembly partners’ facilities
Drive module characterization programs, defining and executing test methodologies
Direct mechanical design and packaging strategies, including substrate selection, enclosure design, and vibration/thermal cycling resilience for free-space optics and integrated modules, while integrating DFX principles
Own end-to-end reliability and failure analysis, implementing PoF (physics-of-failure) models, stress testing (e.g., JEDEC-compliant thermal/humidity cycling, electromigration), and root-cause analyses using SEM, FIB, TEM, and CSAM; collaborate with customers on FIT rates, lifetime projections, and CAR, with direct involvement in lab-based analysis
Collaborate cross-functionally with R&D, silicon photonics, optics, and VLSI teams to align on product roadmaps, perform risk assessments (e.g., FMEA), and drive continuous improvements in yield, cost, and scalability for AI hardware
Develop innovative solutions to our groundbreaking products, and translate those innovations to patents to add to our growing portfolio
Stay abreast of industry advancements in photonic integration, co-packaged optics, and AI hardware manufacturing through ecosystem engagement, publications, and standards bodies (e.g., IEEE, OIF), informing Neurophos' innovation pipeline with hands-on application to our technology
Qualification
Required
Experience delivering optical or photonics assemblies, including developing and transferring to production active alignment setups
Hands-on expertise across IC assembly (including co-packaged optics), module characterization, thermal/mechanical design, reliability engineering, and failure analysis, with personal involvement in transitioning products from prototype to high-volume manufacturing
Advanced degree (Master's or Ph.D.) in Electrical Engineering, Mechanical Engineering, Materials Science, Applied Physics, or a related field, with a strong foundation in semiconductor physics, photonics, and integrated optics
15+ years of progressive, hands-on experience in product engineering within semiconductor, silicon photonics, or optical computing companies, including 5+ years in senior technical leadership roles where you personally contributed to building and scaling engineering teams
Demonstrated deep technical expertise and direct experience taking products from initial definition through to high-volume production, including rigorous application of DFM and DFT principles to optimize manufacturability, testability, yield, and cost—proven across multiple product cycles in photonic or semiconductor hardware
Proven track record managing relationships with first-tier suppliers (foundries, OSATs, photonic module assembly partners), including contract negotiation, yield optimization, and supply chain risk mitigation in fast-paced environments—through direct technical engagements
Exceptional leadership and people management skills, combined with a hands-on technical mindset, with a history of recruiting diverse, high-caliber teams and driving cross-functional execution in resource-constrained startup settings through your own deep involvement
Outstanding communication and stakeholder management abilities, capable of translating complex technical concepts for executives, customers, and partners while thriving in ambiguity and rapid iteration
Analytical mindset with expertise in data-driven decision-making, including yield modeling, failure mode analysis, and process optimization for photonic and electronic components
Preferred
Experience with AI/hardware ecosystems, including delivering on hyperscaler requirements for optical interconnects, power efficiency, and scalability in data center applications
Hands-on leadership experience at photonic or optical large corporations or executive experience in photonics startups, with direct involvement in CPO deployments or AI accelerator hardware (e.g., GPU/TPU integration)
Strong proficiency in design and analysis tools (e.g., ANSYS for thermal modeling, JMP/Minitab for statistical analysis) and industry standards (e.g., JEDEC, IPC, ISO for quality/reliability)
Background in operational excellence, including lean manufacturing principles for high-volume products
Publications, patents, or conference contributions in silicon photonics, co-packaged optics, or reliability for optical modules
Familiarity with emerging technologies like metamaterials, compute-in-memory, or 3D heterogeneous integration
Direct hands-on experience working with free-space optics, as well as productization of camera or optical modules from concept to production
Benefits
Competitive compensation, including salary and equity options.
Opportunities for career growth and future team leadership.
Access to cutting-edge technology and state-of-the-art facilities.
Company
Neurophos
Exaflop optical AI acceleration.
11-50 employees
H1B Sponsorship
Neurophos has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2023 (1)
Funding
Current Stage
Early StageTotal Funding
$16.1MKey Investors
Gates Frontier FundMetaVC Partners
2025-12-08Series Unknown· $1.9M
2023-12-14Seed· $7.2M
2023-10-03Seed· $7M
Leadership Team
Patrick T. Bowen
CEO
Andrew Traverso
Co-founder & Chief Scientist
Recent News
2025-09-24
eeNews Europe
2025-08-21
Company data provided by crunchbase