Associate Physical Vapor Deposition (PVD) Process Engineer / Physical Vapor Deposition (PVD) Process Engineer 3rd shift - R10214139 jobs in United States
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Northrop Grumman · 1 month ago

Associate Physical Vapor Deposition (PVD) Process Engineer / Physical Vapor Deposition (PVD) Process Engineer 3rd shift - R10214139

Northrop Grumman is a leader in technological advancements, seeking a talented Physical Vapor Deposition (PVD) Process Engineer for their Advanced Technology Lab. The role involves sustaining PVD processes for semiconductor manufacturing, developing processes for emerging technologies, and engaging in continuous improvement efforts.

AerospaceData IntegrationManufacturingRemote SensingSecurity
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Growth Opportunities
badNo H1BnoteSecurity Clearance RequirednoteU.S. Citizen Onlynote

Responsibilities

All aspects of sustaining PVD processes for semiconductor manufacturing. This includes process qualifications, technician training and certification, and process safety
Interfacing with other unit process engineers and product integration engineers to develop processes to support emerging technologies
Supporting statistical process control (SPC) and continuous improvement efforts
Establishing standard operating procedures and engaging the operations team to ensure these are followed
Training technicians and maintaining process documentation
Performing all other related duties as assigned

Qualification

Physical Vapor Deposition (PVD)Semiconductor fabricationStatistical process control (SPC)Lean manufacturing practicesCleanroom environment experienceCommunication skillsProblem solving skillsTeamwork

Required

Bachelors in Electrical Engineering, Chemical Engineering, Materials Engineering and Mechanical Engineering, Chemistry, Physics or other related STEM degree with 1 year related experience
Have basic understanding/knowledge of semiconductor physical vapor deposition (PVD) or other related semiconductor fabrication techniques
Must possess good interpersonal and communication skills, both written and verbal, problem solving skills with ability to work with a diverse group of people including technicians, engineers and management
Must be able to work a large percentage of time in a Class 100 cleanroom environment and be able to meet all physical and PPE requirements
Must be able to work 3rd shift, which is Monday-Friday, 11:00PM-7:00AM
Ability to obtain and maintain a Top Secret clearance
US Citizenship required
Bachelors in Electrical Engineering, Chemical Engineering, Materials Engineering and Mechanical Engineering, Chemistry, Physics or other related STEM degree with 2 years related experience; Master's degree with 0 years of experience
Must have good understanding/knowledge of physical vapor deposition (PVD) processes
Direct experience with semiconductor fabrication and working in a cleanroom environment
Must possess good interpersonal and communication skills, both written and verbal, problem solving skills with ability to work with a diverse group of people including technicians, engineers and management
Must be able to work a large percentage of time in a Class 100 cleanroom environment and be able to meet all physical and PPE requirements
Must be able to work 3rd shift which is Monday-Friday, 11:00PM-7:00AM
Ability to obtain and maintain a Top Secret clearance
US Citizenship required

Preferred

Hands-on experience in metal evaporation and/or sputtering techniques, equipment and practices
Experience in lean manufacturing practices and structured problem-solving methodology, DOEs
Knowledge of statistical process control (SPC), JMP, Minitab
Active Top Secret clearance

Benefits

Health insurance coverage
Life and disability insurance
Savings plan
Company paid holidays
Paid time off (PTO) for vacation and/or personal business

Company

Northrop Grumman

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Northrop Grumman is an aerospace, defense and security company that provides training and satellite ground network communications software.

Funding

Current Stage
Public Company
Total Funding
$3.7B
Key Investors
U.S. Department of DefenseNASA
2025-05-27Post Ipo Debt· $1B
2024-01-29Post Ipo Debt· $2.5B
2023-12-20Grant· $72M

Leadership Team

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Tom Wilson
Corporate Vice President, Enterprise Business Development
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Jeffrey Worsham
Chief Product Owner - Advanced Technology Development
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Company data provided by crunchbase