Mechanical Engineering Internship – Summer 2026 jobs in United States
cer-icon
Apply on Employer Site
company-logo

Qualcomm · 10 hours ago

Mechanical Engineering Internship – Summer 2026

positionSanta Clara, CA
timeInternship
remoteOnsite
seniorityIntern
money$17/hr - $98/hr
workcardStart in 2026 Summer

Qualcomm is a leading technology company committed to engineering human progress through intelligent computing. The Mechanical Engineering Internship offers students the opportunity to work on designing, simulating, and testing mechanical and thermal systems that support advanced semiconductor technologies.

Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
check
Comp. & Benefits
check
H1B Sponsor Likelynote

Responsibilities

Work as an equal contributor on a team of leading engineers to design, simulate, and test mechanical and thermal systems
Projects may span IC packaging, chip/package co-design, thermal modeling, signal and power integrity, and next-generation cooling solutions

Qualification

Mechanical EngineeringThermal System DesignFinite Element AnalysisPythonAutoCADSolidworksComputational Fluid DynamicsTeam CollaborationProblem Solving

Required

Currently enrolled in a bachelor's, master's, or Ph.D. degree program in mechanical engineering, materials science, or a related field
Must be available for 11–14 weeks during Summer 2026 (May–September)
Expected graduation date of November 2026 or later
1+ years of academic experience with programming languages such as Python, Matlab

Preferred

Candidates actively pursuing a degree with an anticipated graduation between November 2026 and June 2027
Familiarity with Cadence Sip, AutoCAD, and Solidworks
Coursework in Solid Mechanics, Mechanics of Materials, and Finite Element Analysis (FEA)
Knowledge of IC packaging structures, chip-package interaction, and electronic packaging processes
Experience with thermal system design, modeling, and testing
Understanding of heat transfer, mechanical design, and microelectronics
Exposure to server product design, system impedance testing, fan performance measurement, and heatsink design methodology
Experience with Computational Fluid Dynamics (CFD), wind tunnel, and/or airflow bench operation

Benefits

Competitive hourly pay
Accrued vacation time
Relocation coverage
Furnished housing accommodations
Competitive annual discretionary bonus program
Opportunity for annual RSU grants

Company

Qualcomm

twittertwittertwitter
Glassdoor4.0
company-logo
Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.
dateFounded in 1985
location
San Diego, California, USA
people-size10001+ employees
web-link
http://www.qualcomm.com

H1B Sponsorship

Qualcomm has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2013)
2024 (1910)
2023 (3216)
2022 (2885)
2021 (2104)
2020 (1181)

Funding

Current Stage
Public Company
Total Funding
$3.5M
1991-12-20IPO
1988-01-01Undisclosed· $3.5M

Leadership Team

leader-logo
Cristiano Amon
President and Chief Executive Officer
linkedin
I
Isaac Eteminan
CEO
linkedin

Recent News

KoreaTechToday - Korea's Leading Tech and Startup Media Platform
Qualcomm Considers Samsung 2nm Chips to Reduce Reliance on TSMC
2026-01-13
BiometricUpdate.com
TFH integrates biometrics from Authsignal, Qualcomm for palm payments
2026-01-12
Indian Express
I tried the Samsung Galaxy XR mixed-reality headset at CES 2026. It’s way better than Apple Vision Pro
2026-01-12
Company data provided by crunchbase