Sr. Product Line Manager – Advanced Packaging & Metrology (E) jobs in United States
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KLA · 2 months ago

Sr. Product Line Manager – Advanced Packaging & Metrology (E)

KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. The Product Line Manager for Advanced Packaging & Metrology will drive product strategy, lifecycle management, and market analysis for next-generation semiconductor packaging and metrology solutions, requiring a blend of technical depth and market insight.

ElectronicsInformation TechnologyManufacturing
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H1B Sponsor Likelynote

Responsibilities

Define and own the product roadmap, including technical direction, feature prioritization, and strategic decisions on architecture and specifications
Manage the full product lifecycle from concept through end-of-life, ensuring alignment with division goals and objectives
Oversee project planning, scope, schedule, budget, and resource allocation
Own the product line’s P&L, including revenue, margin, and cost structure
Drive Balanced Scorecard metrics: cost, growth, customer satisfaction, and innovation
Analyze market trends and technology inflections (e.g., 2.5D/3D integration, hybrid bonding, backside power delivery, chiplet architectures, fan-out packaging, co-packaged optics)
Conduct strategic market studies and competitive analysis to guide investment decisions and identify growth opportunities
Evaluate and prioritize customer feature requests; translate market needs into actionable development plans
Assess emerging technologies and forecast their growth potential
Build and maintain strong relationships with customers, understanding their requirements and expectations
Drive product adoption and penetration in advanced packaging and metrology segments
Lead customer engagement strategies through Field Marketing and Applications Engineering
Act as the primary point of contact between customers and the division, supporting pre-sales and after-sales projects
Collaborate with R&D, Engineering, Sales, Marketing, Operations, and global teams to ensure successful product execution
Facilitate clear communication among project teams, stakeholders, and senior management, providing regular updates on status, risks, and mitigation plans
Champion product vision internally and externally
Engage with a global installed base, requiring approximately 30–40% business travel (domestic and international), based on business needs

Qualification

Advanced packagingMetrology technologiesProduct managementPLM toolsMarket analysisCustomer engagementAnalytical skillsLeadership skillsCommunication skills

Required

Bachelor's, Master's, or PhD in Engineering, Physics, Materials Science, or related technical field
5+ years of experience in product management, applications engineering, or technical marketing, preferably in the semiconductor or advanced packaging/metrology industry
Deep understanding of advanced packaging manufacturing processes and equipment (including 2.5D/3D packaging, hybrid bonding, chiplet architectures, fan-out packaging, CoWoS, SOIC, HBM and related metrology or inspection technologies)
Experience with PLM tools, financial modeling, and customer engagement strategies
Proven ability to develop and execute market strategies and product roadmaps
Knowledge of wafer inspection technologies and tools
Strong analytical, communication, and leadership skills
Willingness and ability to travel internationally (30–40%)

Preferred

Experience working with global teams and diverse customer bases
Ability to translate technical concepts into business value
Familiarity with competitive analysis and strategic market development for advanced packaging products

Benefits

Medical
Dental
Vision
Life
Other voluntary benefits
401(K) including company matching
Employee stock purchase program (ESPP)
Student debt assistance
Tuition reimbursement program
Development and career growth opportunities and programs
Financial planning benefits
Wellness benefits including an employee assistance program (EAP)
Paid time off
Paid company holidays
Family care and bonding leave

Company

Kla creates tools and services that promote innovation in the electronics industry.

H1B Sponsorship

KLA has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (343)
2024 (218)
2023 (191)
2022 (277)
2021 (200)
2020 (226)

Funding

Current Stage
Late Stage

Leadership Team

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Lisa Grunwald
FISH Philosophy CEO
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Rick Wallace
President & CEO
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