Software Engineering Intern jobs in United States
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Cadence · 7 hours ago

Software Engineering Intern

Cadence is a technology company that hires and develops leaders and innovators. They are seeking a Software Engineering Intern to assist in research and development, particularly in machine learning and natural language processing.

AerospaceElectronic Design Automation (EDA)HardwareMobileSemiconductorSoftware
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Growth Opportunities
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H1B Sponsor Likelynote

Qualification

Machine LearningPythonDeep LearningNatural Language ProcessingC++Retrieval-Augmented GenerationAnalytical ThinkingDebugging SkillsCollaboration

Required

Pursuing or recently completed a degree in Computer Science, Applied Mathematics, Data Science, or a related field
Strong foundation in machine learning, deep learning, and natural language processing (NLP) and LLM
Proficiency in Python and experience with frameworks like PyTorch, TensorFlow, SciKit, etc
Basic understanding of Retrieval-Augmented Generation (RAG) and vector databases
Comfortable working with LLM APIs and integrating them into applications
A solid understanding of machine learning concepts (e.g., supervised/unsupervised learning, NLP, computer vision) and algorithms is crucial
Proficiency in Python is essential. C++ also valuable
Ability to work in a fast-paced research and development environment
Strong analytical thinking and debugging skills
Experience with rapid prototyping in open-source AI/ML projects

Company

Cadence is a market leader in AI and digital twins, pioneering the application of computational software to accelerate innovation in the engineering design of silicon to systems.

H1B Sponsorship

Cadence has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (306)
2024 (221)
2023 (282)
2022 (330)
2021 (233)
2020 (209)

Funding

Current Stage
Public Company
Total Funding
unknown
1998-02-20IPO

Leadership Team

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Paul Cunningham
Senior Vice President and General Manager
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Tom Beckley
Senior Vice President, Custom IC & PCB Group
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Company data provided by crunchbase