Broadcom · 2 weeks ago
Advanced Packaging Development Engineer
USA-CA Irvine Alton Parkway Bldg 2
Full-time
Onsite
Senior Level, Lead/Staff
$127K/yr - $203K/yr
15+ years expBroadcom is a leading technology company specializing in advanced packaging technology. They are seeking an expert in advanced packaging technology development with significant experience in 2.5D / 3D packaging, project management, and teamwork skills.
MobileSemiconductorWireless
Qualification
Required
At least 15 years experience in 2.5D / 3D packaging related development work
Project management and team work skills
Strength in technology innovation, development, and enablement
Preferred
A Ph.D. degree in related engineering field
Benefits
Medical, dental and vision plans
401(K) participation including company matching
Employee Stock Purchase Program (ESPP)
Employee Assistance Program (EAP)
Company paid holidays
Paid sick leave and vacation time
Paid Family Leave
Company
Broadcom
Broadcom is a designer, developer, and global supplier of a broad range of analog and digital semiconductor connectivity solutions.
10001+ employees
H1B Sponsorship
Broadcom has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (92)
2024 (77)
2023 (79)
2022 (112)
2021 (110)
2020 (89)
Funding
Current Stage
Public CompanyTotal Funding
unknown2017-10-31Post Ipo Equity
2015-05-28Acquired
1998-04-17IPO
Leadership Team
Greg Singh
CTO for APJ, Enterprise Security Group
Kirsten Spears
CFO and CAO, Broadcom
Recent News
2026-01-11
Company data provided by crunchbase