Senior Principal Signal and Power Integrity Engineer jobs in United States
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Arm · 1 week ago

Senior Principal Signal and Power Integrity Engineer

Arm is seeking an experienced and highly motivated Signal and Power Integrity engineer to join their SIPI team and work on the future of System-in-Package designs. The role involves creating and analyzing novel designs, delivering robust methodologies, and ensuring electrical integrity solutions, while collaborating closely with teams across various locations.

AnalyticsElectronicsInternet of ThingsSemiconductorSoftware
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Creating and analysing novel System-in-Package designs
Delivering robust design methodologies and silicon/platform electrical integrity solution spaces
Creating or supervising package designs
Running specific packaging analysis tools
Playing a tech lead role
Working closely with teams in UK, France, and other Arm locations
Supervising lab evaluations of the on post-silicon chip
Debugging and solving any possible system level issues

Qualification

Signal IntegrityPower IntegritySIPI analysis toolsMulti-port matrixesElectromagnetic extractionPackage designSoC implementationsAdvanced packagingLinux environmentPython scriptingMentoringInterpersonal skillsAttention to detailProblem solving

Required

Engineering degree or equivalent
You hold ideally 5 or more years of experience in System level Signal Integrity with focus on interfaces' impact on systems
Be very good at working with SIPI analysis environments (Ansys suite, Cadence, or other)
Have deep understanding of multi-port matrixes (S, Y, Z parameters)
Possess good understanding of electromagnetic extraction methodologies and their limitations
Understanding of package drawing to effectively drive a design engineer and perform package drawing modifications tasks on occasional basis
Able to provide technical directions to the sub-workgroups and influencing key product/platform roadmap decisions
Pre-layout platform design guideline development for SI/PI interfaces

Preferred

Have good understanding SoC implementations and models (IBIS models, power models, impedance profiles of power delivery networks)
Experience in System level Power Integrity with focus on package level PI trade-offs
Experienced in complete package design flow from ball map stage up to final tape-out and well versed with all the steps and setup required
Knowledge in packaging manufacturing steps, and their constraints
Experience on advanced packaging (2.5D, 3D)
Knowledge of Linux environment and scripting (Python, Skill,…)

Benefits

Private medical insurance (employee and family)
20-day sabbatical every four years
Supplementary pension

Company

Arm’s foundational technology is defining the future of computing. A future built by the greatest technology ecosystem in the world.

H1B Sponsorship

Arm has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (295)
2024 (166)
2023 (164)
2022 (123)
2021 (103)
2020 (133)

Funding

Current Stage
Public Company
Total Funding
unknown
2016-07-18Acquired
1999-01-15IPO

Leadership Team

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Rene Haas
CEO
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Jason Child
EVP & CFO
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Company data provided by crunchbase