Engineering Support / Program Manager - DRAM PI jobs in United States
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Micron Technology · 10 hours ago

Engineering Support / Program Manager - DRAM PI

Micron Technology is a world leader in innovating memory and storage solutions. They are seeking a highly detailed and dependable Process Integration (PI) Module Support Engineer to drive module execution, data interpretation, and operational excellence in the DRAM team.

ComputerHardwareManufacturingSemiconductor
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H1B Sponsor Likelynote

Responsibilities

Collaborate with PI Module Engineers to interpret data, complete conversions, and support assigned process modules
Serve as the primary contact for experiment coordination, conversion activities, and lot-movement logistics
Partner with PI Module Owners, Process Area Owners, Conversion Coordinators, and Change Management to ensure smooth execution of module support tasks
Drive continuous improvement initiatives in conversion processes and lot logistics for the DRAM team
Mentor team members at all levels on best-known methods (BKMs) for conversion and logistics workflows
Enhance operational efficiency through proactive engagement with supporting groups and partners
Lead module-level engineering support including: GCP creation, Conversion planning and reviews, SWR troubleshooting, Lot hold mitigation and Traveler revision updates
Analyze data to support SWR resolution and improve module operational performance
Maintain accuracy and timeliness in program achievements by continually refreshing dates and performance expectations with program stakeholders
Ensure transparent communication with partners to support program success
Support achievement risk management through: Pareto analysis and familiarity with key detection reads, Prioritization tag assignment and optimization, Rapid iteration (fail fast) and tag reuse when appropriate
Understand cycle time (CT) by priority level to support glidepath projections and CoL planning ahead of major program milestones

Qualification

Process IntegrationData AnalysisSWR TroubleshootingDRAM Process FlowsCycle-Time OptimizationEffective CommunicationMentoringProblem-SolvingAttention to Detail

Required

Strong analytical skills with experience interpreting data to guide engineering decisions
Ability to manage multiple tasks, coordinate experiments, and oversee logistics in a fast-paced environment
Effective communication and ability to collaborate across engineering, operations, and change management teams
Demonstrated dependability, attention to detail, and commitment to continuous improvement
Ability to mentor and guide team members on established best practices
Problem-solving mindset, particularly in SWR troubleshooting and root-cause identification

Preferred

Previous experience in Process Integration, semiconductor fabrication, or module engineering support
Familiarity with DRAM process flows, inline detection methodologies, and Pareto analysis
Experience creating GCPs, managing conversions, and supporting cycle-time optimization
Understanding of priority-based lot management and program milestone planning
Background in change management workflows and traveler/document revision processes

Benefits

Choice of medical, dental and vision plans
Benefit programs that help protect your income if you are unable to work due to illness or injury
Paid family leave
Robust paid time-off program
Paid holidays

Company

Micron Technology

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Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips.

H1B Sponsorship

Micron Technology has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (494)
2024 (429)
2023 (299)
2022 (626)
2021 (564)
2020 (538)

Funding

Current Stage
Public Company
Total Funding
$8.9B
Key Investors
U.S. Department of Commerce
2025-04-24Post Ipo Debt· $1.75B
2025-01-16Post Ipo Debt· $1B
2024-04-18Grant· $6.1B

Leadership Team

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Sanjay Mehrotra
Chairman, President & CEO
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Gursharan Singh
Senior Vice President BE Operations
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Company data provided by crunchbase