Boyd · 5 hours ago
Senior Systems Engineer – TCU Systems
Boyd is a company focused on advanced electro-mechanical systems used in semiconductor testing. They are seeking a Senior Systems Engineer to lead the design, integration, and optimization of TCU systems, providing technical leadership across various engineering teams to ensure high precision and reliability.
Consumer ElectronicsElectronicsManufacturing
Responsibilities
Lead system architecture, requirements definition, and integration planning for TCU systems and related peripheral equipment
Oversee integration of thermal subsystems, control electronics, and embedded controllers
Drive system-level validation, calibration, and performance characterization (accuracy, repeatability, thermal stability, signal integrity)
Diagnose complex issues involving mechanical precision, electrical noise, automation logic, or reliability; lead root-cause analysis and corrective actions
Collaborate with software, controls, mechanical, and electrical teams to implement motion control, automation workflows, and system logic
Ensure compliance with Boyd and customer standards, safety regulations, and industry best practices
Support DFM/DFA, pilot builds, manufacturing transfer, and field escalations for production systems
Mentor junior engineers and provide technical guidance during design reviews and cross-functional decisions
Qualification
Required
Bachelor's in mechanical engineering, electrical engineering, systems engineering or other engineering related field
10+ years of experience in electro-mechanical system design, integration, or testing—preferably with semiconductor ATE or handler systems
Expertise with precision mechanics, motion control, robotics, sensors, thermal systems, and embedded control integration
Proficiency with CAD/electrical schematics and system-level troubleshooting
Strong understanding of alignment, metrology, vibration control, and contamination considerations
Familiarity with FEA/CFD, Solidworks, and automation/test tools
Preferred
Masters's in Engineering Management or Business Administration
Expert level experience with TCU systems and handler integrated equipment
15+ years of experience in electro-mechanical system design, integration, or testing—preferably with semiconductor ATE or handler systems
Expertise in various IC packages (i.e. QFN, BGA, QFP, CSP, etc.) and methods for accommodating testing techniques of each class
Advanced design with TCU socket/package adapter technology, methods, limitations, etc
Experience with wafer probe stations, handlers, automated test equipment, or similar capital equipment
Certifications: Six Sigma, Lean and/or industry-specific training
Strong familiarity with the IC industry, history, trends
Company
Boyd
Boyd is a energy management and environmental sealing solutions for large OEMs.
H1B Sponsorship
Boyd has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2024 (1)
2023 (2)
2020 (2)
Funding
Current Stage
Late StageTotal Funding
unknown2018-07-11Acquired
2015-04-16Undisclosed
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