SpaceX · 6 hours ago
IC Package Engineer (Starlink/Akoustis)
Bastrop, TX
Full-time
Onsite
Entry, Mid Level
1+ years expSpaceX is actively developing technologies to enable human life on Mars. They are seeking a highly skilled IC Package Engineer to lead the development, qualification, and implementation of advanced integrated circuit packaging solutions, working cross-functionally to deliver optimized semiconductor packaging.
Advanced MaterialsAerospaceManufacturingNational SecuritySpace Travel
No H1B
U.S. Citizen Only
Responsibilities
Design, develop, and qualify IC packaging technologies including flip-chip, wire bonding, wafer-level packaging (WLP), QFN, CSP, and LGA
Evaluate and select packaging materials (substrates, mold compounds, underfills, adhesives) based on thermal, mechanical, and electrical properties
Drive thermal management strategies within packages, including simulation and implementation of heat dissipation techniques
Define and execute reliability test plans (e.g., thermal cycling, uHAST, HTOL) for qualification of package designs
Utilize EDA/CAD tools (e.g., AutoCAD) for mechanical layout, with experience in ANSYS or other simulation tools as a plus
Apply DFM methodologies to ensure manufacturability, reliability, and testability from concept through production
Provide technical guidance for IC assembly and packaging processes, including SMT, die attach, reflow, wire bonding, underfill, and encapsulation
Conduct and support failure analysis investigations using tools like X-ray, SEM, FIB, and cross-sectioning to drive root cause and corrective actions
Perform root cause analysis and data-driven troubleshooting using tools such as FMEA, SPC, and Six Sigma methodologies
Collaborate with PCB and substrate design teams to ensure co-design compatibility and package-board integration
Own project timelines, risks, and deliverables related to packaging initiatives and report progress to key stakeholders
Qualification
Required
Bachelor's degree in mechanical Engineering, packaging Engineering, materials science, electrical Engineering, or other engineering discipline
1+ year of experience designing, qualifying, or implementing IC packaging solutions (internships and academic projects are applicable)
Design, develop, and qualify IC packaging technologies including flip-chip, wire bonding, wafer-level packaging (WLP), QFN, CSP, and LGA
Evaluate and select packaging materials (substrates, mold compounds, underfills, adhesives) based on thermal, mechanical, and electrical properties
Drive thermal management strategies within packages, including simulation and implementation of heat dissipation techniques
Define and execute reliability test plans (e.g., thermal cycling, uHAST, HTOL) for qualification of package designs
Utilize EDA/CAD tools (e.g., AutoCAD) for mechanical layout, with experience in ANSYS or other simulation tools as a plus
Apply DFM methodologies to ensure manufacturability, reliability, and testability from concept through production
Provide technical guidance for IC assembly and packaging processes, including SMT, die attach, reflow, wire bonding, underfill, and encapsulation
Conduct and support failure analysis investigations using tools like X-ray, SEM, FIB, and cross-sectioning to drive root cause and corrective actions
Perform root cause analysis and data-driven troubleshooting using tools such as FMEA, SPC, and Six Sigma methodologies
Collaborate with PCB and substrate design teams to ensure co-design compatibility and package-board integration
Own project timelines, risks, and deliverables related to packaging initiatives and report progress to key stakeholders
Must be willing to work extended hours and weekends as needed to meet critical milestones
Ability to travel up to 20% domestically and internationally for supplier and manufacturing support
Ability to perform light physical tasks (lifting up to 25 lbs, handling packaging samples)
To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State
Preferred
2+ years of hands-on experience with semiconductor packaging technologies, including: Flip-chip, wire bond, WLP, LGA, CSP, QFN
Organic/inorganic substrates and PCB manufacturing
Deep understanding of packaging materials and their thermal, mechanical, and electrical properties
Familiarity with thermal management techniques for power-dense or mission-critical electronics
Experience with reliability testing, including JEDEC and IPC standards (e.g., thermal cycling, uHAST, HTS, vibration)
Knowledge of assembly processes: SMT, die attach, reflow soldering, encapsulation, underfill, etc
Strong analytical skills with expertise in: Root Cause Analysis, Statistical Process Control (SPC), Six Sigma / Lean tools, Failure Mode and Effects Analysis (FMEA)
Experience with EDA/CAD tools such as AutoCAD (required); ANSYS or COMSOL (a plus)
Proven ability to lead cross-functional efforts across design, reliability, manufacturing, and supply chain
Strong project management, organizational, and communication skills
Company
SpaceX
SpaceX is an aviation and aerospace company that designs, manufactures, and launches rockets and spacecraft.
1001-5000 employees
Funding
Current Stage
Late StageTotal Funding
$11.78BKey Investors
Korea Investment PartnersIntesa SanpaoloAndreessen Horowitz
2025-12-12Secondary Market
2025-09-10Secondary Market
2025-08-13Secondary Market· $10M
Leadership Team
Bret Johnsen
CFO
Charles Kuehmann
VP Materials Engineering
Recent News
2025-12-30
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2025-12-29
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