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SpaceX · 5 hours ago

IC Package Engineer (Starlink/Akoustis)

Bastrop, TX

Full-time

Onsite

Entry, Mid Level

1+ years exp

SpaceX is a company focused on developing technologies for human life on Mars. They are seeking a highly skilled IC Package Engineer to lead the development, qualification, and implementation of advanced integrated circuit packaging solutions.

Advanced MaterialsAerospaceManufacturingNational SecuritySpace Travel

Growth Opportunities

No H1B

U.S. Citizen Only

Responsibilities

Design, develop, and qualify IC packaging technologies including flip-chip, wire bonding, wafer-level packaging (WLP), QFN, CSP, and LGA

Evaluate and select packaging materials (substrates, mold compounds, underfills, adhesives) based on thermal, mechanical, and electrical properties

Drive thermal management strategies within packages, including simulation and implementation of heat dissipation techniques

Define and execute reliability test plans (e.g., thermal cycling, uHAST, HTOL) for qualification of package designs

Utilize EDA/CAD tools (e.g., AutoCAD) for mechanical layout, with experience in ANSYS or other simulation tools as a plus

Apply DFM methodologies to ensure manufacturability, reliability, and testability from concept through production

Provide technical guidance for IC assembly and packaging processes, including SMT, die attach, reflow, wire bonding, underfill, and encapsulation

Conduct and support failure analysis investigations using tools like X-ray, SEM, FIB, and cross-sectioning to drive root cause and corrective actions

Perform root cause analysis and data-driven troubleshooting using tools such as FMEA, SPC, and Six Sigma methodologies

Collaborate with PCB and substrate design teams to ensure co-design compatibility and package-board integration

Own project timelines, risks, and deliverables related to packaging initiatives and report progress to key stakeholders

Qualification

IC packaging solutionsSemiconductor packagingThermal management techniquesReliability testingEDA/CAD toolsRoot Cause AnalysisStatistical Process ControlSix SigmaProject managementCommunication skills

Required

Bachelor's degree in mechanical Engineering, packaging Engineering, materials science, electrical Engineering, or other engineering discipline

1+ year of experience designing, qualifying, or implementing IC packaging solutions (internships and academic projects are applicable)

Must be willing to work extended hours and weekends as needed to meet critical milestones

Ability to travel up to 20% domestically and internationally for supplier and manufacturing support

Ability to perform light physical tasks (lifting up to 25 lbs, handling packaging samples)

To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State

Preferred

2+ years of hands-on experience with semiconductor packaging technologies, including: Flip-chip, wire bond, WLP, LGA, CSP, QFN

Deep understanding of packaging materials and their thermal, mechanical, and electrical properties

Familiarity with thermal management techniques for power-dense or mission-critical electronics

Experience with reliability testing, including JEDEC and IPC standards (e.g., thermal cycling, uHAST, HTS, vibration)

Knowledge of assembly processes: SMT, die attach, reflow soldering, encapsulation, underfill, etc

Strong analytical skills with expertise in: Root Cause Analysis, Statistical Process Control (SPC), Six Sigma / Lean tools, Failure Mode and Effects Analysis (FMEA)

Experience with EDA/CAD tools such as AutoCAD (required); ANSYS or COMSOL (a plus)

Proven ability to lead cross-functional efforts across design, reliability, manufacturing, and supply chain

Strong project management, organizational, and communication skills