Material & Process Engineer- ElectroMechanical jobs in United States
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Lockheed Martin · 2 weeks ago

Material & Process Engineer- ElectroMechanical

Lockheed Martin is an award-winning company driven by innovation and integrity. They are seeking a Process Engineer to support manufacturing operations and ensure circuit cards are built to standards, contributing to the production of advanced electronic systems.

AerospaceCyber SecurityMachinery ManufacturingMilitaryNational SecurityRemote SensingSecurity
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Support manufacturing operations
Work closely with other engineers and operators to ensure all circuit cards are built per our standards

Qualification

Select Solder equipmentTroubleshooting circuit boardsElectronics manufacturing processesAnalytical skillsProblem-solving skills

Required

Hands-on experience with Select Solder equipment- such as programming, troubleshooting, and optimizing machine performance
Ability to troubleshoot and rework circuit boards as needed
Analytical and problem-solving skills to identify areas for improvement and implement process enhancements
Knowledge of electronics manufacturing processes and conventional part‑fabrication techniques

Benefits

Medical insurance
Legal help
Tuition reimbursement

Company

Lockheed Martin

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Lockheed Martin is a global security and aerospace company that specializes in advanced technology systems, products, and services. It is a sub-organization of Lockheed Martin.

H1B Sponsorship

Lockheed Martin has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (1)
2023 (1)
2022 (1)
2021 (2)

Funding

Current Stage
Public Company
Total Funding
$6.06B
Key Investors
Air Force Research Laboratory
2025-12-05Post Ipo Debt· $3B
2025-08-28Post Ipo Debt· $3B
2023-11-13Grant· $33.7M

Leadership Team

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Jim Taiclet
Chairman, President & CEO
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Craig Martell
Chief Technology Officer
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Company data provided by crunchbase