Design Engineer Intern jobs in United States
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MACOM · 2 months ago

Design Engineer Intern

MACOM designs and manufactures semiconductor products for various applications including Data Center and Telecommunication. The Design Engineer Intern will work alongside experienced engineers, gaining valuable work experience and taking ownership of a business-critical project.

ElectronicsIndustrialInformation TechnologyInternetMachinery ManufacturingManufacturingSemiconductorTechnical SupportWireless
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H1B Sponsor Likelynote

Responsibilities

Be given an individual and well-defined project with set outcome goals
Gain hands on experience
Receive excellent training and ongoing supervision
Be invited to attend an intern webinar series
Attend networking/social events
Attend and present at Poster Session about each Interns project successes and pitfalls
Receive formal, written feedback

Qualification

Digital System/ASIC designVerilog RTL codingTCLPythonShell scriptingStatic timing conceptsPlanningOrganizationInterpersonal skillsProblem-solvingTeamworkAdaptability

Required

Candidate must be presently pursuing MSEE or PhD in area relating to Digital System/ASIC design
Interest in learning and developing digital ASIC place and route skills
Familiarity in TCL, Python and shell scripting languages for automation
Familiarity with static timing concepts
Good planning and organizational skills
Good interpersonal and communications skills
Good problem-solving and analytical skills
Honesty and ability to work well in a team environment
Willingness to learn and adapt to new concepts

Preferred

Having experience with Verilog RTL coding design

Company

MACOM is a supplier of high-performance analog RF, microwave, millimeterwave, and photonic semiconductor products.

H1B Sponsorship

MACOM has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (7)
2024 (8)
2023 (16)
2022 (2)
2021 (6)
2020 (5)

Funding

Current Stage
Public Company
Total Funding
$43.75M
2012-03-15IPO
2011-01-12Private Equity
2010-06-08Private Equity· $43.75M

Leadership Team

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Stephen Daly
President & CEO, Director
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Cristian Stagarescu
Principal Engineer Photonics R&D
Company data provided by crunchbase