Career Accelerator Program - Packaging Engineer - MS/PhD jobs in United States
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Texas Instruments · 8 hours ago

Career Accelerator Program - Packaging Engineer - MS/PhD

Texas Instruments is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips. They are seeking a Packaging Engineer to participate in the Career Accelerator Program, which provides training and hands-on experience in semiconductor packaging technologies.

ComputerDSPSemiconductor
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Growth Opportunities
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Responsibilities

Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness
Participate in cross-functional teams, supporting product qualification and production, helping to meet reliability and yield requirements, design testability, and test coverage
Direct design-of-experiments and work with material suppliers to downselect innovative packaging materials to enhance the reliability and performance of advanced packages
Conduct electrical, mechanical, thermal models to comprehend silicon-to-package interaction, establish design rules, and to predict and prevent the use of high risk designs

Qualification

Mechanical EngineeringMechanical Stress AnalysisMechanical Stress ModelingSemiconductor Packaging KnowledgeAnalytical SkillsCommunication SkillsTeam CollaborationTime ManagementRelationship BuildingInitiative

Required

Masters' degree in Mechanical Engineering, Physics, or related
Cumulative 3.0/4.0 GPA or higher

Preferred

Cumulative 3.5/4.0 GPA or higher
Demonstrated expertise in mechanical stress analysis and management
Hands-on experience in mechanical stress modeling using industry software such as ANSYS
Hands-on experience or working knowledge on mechanical characterization of materials (metals/alloys, polymers, ceramics, etc.)
Semiconductor back-end-of-line processing knowledge is preferred (fab manufacturing processes for Al and Cu based back-end-of-line)
Semiconductor packaging knowledge is preferred (manufacturing processes, assembly, reliability, materials, characterization, FA)
Demonstrated analytical and problem solving skills
Strong written and verbal communication skills
Ability to work in teams and collaborate effectively with people in different functions
Strong time management skills that enable on-time project delivery
Ability to build strong, influential relationships
Ability to work effectively in a fast-paced and rapidly changing environment
Ability to take the initiative and drive for results

Benefits

Competitive pay and benefits designed to help you and your family live your best life

Company

Texas Instruments

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Texas Instruments is a global semiconductor company that manufactures, designs, tests, and sells embedded and analog processing chips.

Funding

Current Stage
Public Company
Total Funding
$13.61B
Key Investors
U.S. Department of Commerce
2025-05-20Post Ipo Debt· $1.2B
2024-12-20Grant· $1.61B
2024-05-28Post Ipo Equity· $2.5B

Leadership Team

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Richard Templeton
President and Chief Executive Officer
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Krunali Patel
Senior vice president and chief information officer
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Company data provided by crunchbase