Cadence · 2 hours ago
Principal Product Engineer- Physical Layer
Cary, NC
Full-time
Onsite
Senior Level, Lead/Staff
5+ years expCadence is a pivotal leader in electronic design, known for its expertise in computational software. The Principal Product Engineer serves as a key technical interface between Cadence and top-tier customers, managing technical communications, driving customer issue resolution, and ensuring successful product integration.
AerospaceElectronic Design Automation (EDA)HardwareMobileSemiconductorSoftware
Responsibilities
Act as the main technical point of contact for customer engineering teams; attend and lead weekly customer calls organized by program management
Ensure inclusion in all relevant customer communications, technical deep-dives, and milestone reviews; provide status updates and action tracking
Demonstrate a strong understanding of Physical and Protocol layers for at least one high-speed interface (e.g., PCIe, Ethernet, USB, CXL, UCIe)
Familiarity with PCIe/UCIe LTSSM states and major Ethernet standards; interpret specs, debug link training, and compliance behaviors
Demonstrate hands-on experience with oscilloscopes, BERTs, protocol exercisers, and analyzers
Diagnose silicon-related issues and interpret test results effectively
Own all support cases filed by the customer across platforms such as SFDC, Sherlock, and Jira
Evaluate and triage incoming cases, determine severity and urgency, and ensure timely resolution in alignment with agreed service levels
Serve as the technical escalation path for complex issues requiring cross-functional involvement (design, validation, firmware, applications)
Organize and lead reviews such as SDC/constraint checks, physical integration assessments, pre-tape out checklist reviews, and bring-up test plan evaluations
Collaborate closely with the customer program manager to ensure smooth communication and inclusion in all relevant meetings
Maintain standardized documentation including kickoff materials, status dashboards, and silicon reports. Track case metrics and provide progress updates
Leverage AI-powered tools and assistants to enhance productivity, improve decision making, and maintain high-quality customer deliverables. Apply AI-powered analytics tools to extract insights, identify patterns, and generate actionable recommendations from complex datasets
Qualification
Required
Bachelor's in computer science or electrical engineering degree with + 7 years of relevant experience, or Master's degree with +5 years of related experience
Skilled at listening to customer concerns and identifying potential issues early
Strong commitment to customer satisfaction and timely case resolution
Broad technical background in relevant IPs (both hard and soft) and product engineering
Strong communication and organizational abilities
Experience performing Physical Layer and Protocol Layer validation for at least one high-speed SERDES technology
Hands-on experience with post-silicon PHY bring-up, system interoperability, and compliance testing activities
Proficiency in using protocol analyzers, BERTs, and oscilloscopes
Familiarity with case management systems such as SFDC and Jira
Ability to prioritize cases, anticipate escalations, and manage technical reviews effectively
High-level understanding of technical issues with the capability to coordinate with subject matter experts
Proactive in gathering feedback and driving continuous improvement initiatives
Able to travel onsite to support customers with Silicon bringup and debug. Travel Requirements : 10%
Company
Cadence
Cadence is a market leader in AI and digital twins, pioneering the application of computational software to accelerate innovation in the engineering design of silicon to systems.
10001+ employees
H1B Sponsorship
Cadence has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (306)
2024 (221)
2023 (282)
2022 (330)
2021 (233)
2020 (209)
Funding
Current Stage
Public CompanyTotal Funding
unknown1998-02-20IPO
Leadership Team
Paul Cunningham
Senior Vice President and General Manager
Tom Beckley
Senior Vice President, Custom IC & PCB Group
Recent News
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