Micron Technology · 8 hours ago
Senior/Staff Process Quality Engineer
Boise, ID
Full-time
Onsite
Senior Level, Lead/Staff
3+ years expMicron Technology is a world leader in innovating memory and storage solutions. As a Process Quality Engineer, you will lead the development of the FOUP Environment Control program, collaborating with various engineering teams to drive enhancements in process quality and wafer yield.
ComputerHardwareManufacturingSemiconductor
Responsibilities
Lead the development of the FOUP Environment Control (FEC) program for ID1 HVM greenfield fab startup, ensuring full system readiness
Partner with engineering teams to define FEC system enablement scope, align partners, secure resources, lead multi-functional meetings, and drive successful system activation
Collaborate with Micron’s global HVM network to capture best-known methods (BKMs) and lessons learned for FEC systems, including yield impact studies from current and previous DRAM nodes. Drive development and execution of FEC system Copy Exact/Copy Smart strategies as appropriate
Supervise production lines for yield issues potentially caused by wafer or process-related contamination and collaborate with Process Integration and Process & Equipment Engineering teams to design and implement experiments for resolution
Partner with vendors to evaluate new hardware and FOUP solutions, while aligning with internal team members to define and drive the roadmap for Fab4 HVM FOUP strategy
Represent the Fab4 PQE team in global alignment meetings with Micron’s fab network and central teams to ensure consistency and best-practice adoption
Assess risks and establish tool-sharing protocols between Fab4 TD and Fab4 HVM (ID1) through collaboration with key partners
Own the New Materials Integration (NMI) business process for TD materials, collaborating closely with fab partners including Process Development, Process Integration, Equipment, and Area Manufacturing Engineering teams
Qualification
Required
Bachelor's or Master's degree in Materials Science & Engineering, Chemical Engineering, Chemistry, or a closely related subject area
3–8 years of hands-on experience in semiconductor manufacturing as a Process Module Development Engineer or Process Integration Engineer
In-depth expertise in DRAM or Logic process areas (such as Dry Etch, Thin Film Deposition, Photolithography, Wet Clean, CMP, and Metrology), with broad familiarity with the equipment used in these domains
Strong grasp of wafer and process-related contamination mechanisms across various process areas, and their effects on yield and product quality
Advanced skills in Statistical Process Control (SPC), including real-time fab data analysis and reporting, with proficiency in JMP for data visualization and analytics, plus deep knowledge of analytical instrumentation and its performance characteristics
Preferred
PhD in Materials Science, Chemical Engineering, Chemistry, or a related science/engineering field
Semiconductor HVM experience in FOUP Environment Control to enhance process quality and improve wafer yield
Willingness to travel internationally to Micron sites in Taiwan, Japan, Singapore, and other locations as needed for teamwork and training
Benefits
Choice of medical, dental and vision plans
Benefit programs that help protect your income if you are unable to work due to illness or injury
Paid family leave
Robust paid time-off program
Paid holidays
Company
Micron Technology
Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips.
10001+ employees
H1B Sponsorship
Micron Technology has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (573)
2024 (429)
2023 (299)
2022 (626)
2021 (564)
2020 (538)
Funding
Current Stage
Public CompanyTotal Funding
$8.9BKey Investors
U.S. Department of Commerce
2025-04-24Post Ipo Debt· $1.75B
2025-01-16Post Ipo Debt· $1B
2024-04-18Grant· $6.1B
Leadership Team
Sanjay Mehrotra
Chairman, President & CEO
Gursharan Singh
Senior Vice President BE Operations
Recent News
2025-12-30
The Motley Fool
2025-12-29
Company data provided by crunchbase