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Thintronics® · 3 days ago

Materials & Process Integration Engineer (entry-level) - Technical & Associate Level

Alameda, CA

Full-time

Onsite

New Grad, Entry Level

$80K/yr - $125K/yr

Thintronics is a fast-moving startup focused on revolutionizing copper interconnect technology for ultra-high-speed data transmission. They are seeking an entry-level Process Integration Engineer to support internal process development and build capabilities in advanced semiconductor packaging through hands-on laboratory work.

Consumer Electronics

H1B Sponsor Likely

Hiring Manager

Stefan Pastine

Responsibilities

Assist in daily lab operations including sample preparation, equipment maintenance, and safety procedures

Perform hands-on experiments across a range of advanced packaging processes, including lithography, etching, lamination, plating, and cleaning

Conduct and document standard operating procedures and contribute to new method development

Support the development and refinement of Thintronics’ internal process capability to mimic state-of-the-art substrate fabrication lines

Run experiments and collect data to support the integration of Thintronics materials into build-up packaging flows

Collaborate closely with senior engineers to execute experimental plans and deliver reliable, reproducible results

Troubleshoot processing issues with attention to detail and a continuous improvement mindset

Engage with R&D, materials, and reliability teams to translate research concepts into manufacturable processes

Support failure analysis and yield improvement efforts with basic inspection and defect documentation

Qualification

Materials ScienceChemical EngineeringMicrofabricationAdditive ProcessesData IntegrityProblem SolvingTeam CollaborationAttention to Detail

Required

B.S. or M.S. in Materials Science, Chemical Engineering, or a related discipline

Passion for hands-on work and enthusiasm for advanced materials and manufacturing processes

Strong work ethic and commitment to contributing in a high-energy, fast-paced team environment

Ability to follow detailed instructions, execute test plans, and maintain high data integrity

Desire to grow within the organization and take ownership of increasingly complex responsibilities

Preferred

Prior experience in a lab or manufacturing environment (internships, co-ops, or academic research) preferred

Basic understanding of microfabrication or additive processes (e.g., lamination, plating, lithography) is a plus

Company

Thintronics®

Thintronics Inc. is reinventing interconnect insulator technologies to unlock next- generation computing, networking and wireless performance.

Founded in 2018

San Francisco, California, USA

11-50 employees

http://thintronics.com/

H1B Sponsorship

Thintronics® has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)

Distribution of Different Job Fields Receiving Sponsorship

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Trends of Total Sponsorships

2025 (1)

2024 (1)