Principal Package Layout Engineer jobs in United States
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Arm · 6 days ago

Principal Package Layout Engineer

Arm is seeking a Principal Package Layout Engineer to join their System-in-Package team. This role involves defining, designing, and verifying package designs for next-generation SoCs in IoT, Automotive, and Compute spaces, while collaborating with various teams and external vendors.

AnalyticsElectronicsInternet of ThingsSemiconductorSoftware
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Growth Opportunities
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H1B Sponsor Likelynote

Responsibilities

Layouts using best-known practices for DFM, DFA, Signal and Power Delivery Networks
Work with minimal supervision and approach challenges with enthusiasm and persistence
Bring forward ideas to improve overall team efficiency
Communicate and coordinate with external vendors as necessary

Qualification

Electrical Engineering degree2.5D3D package systemsCadence APD & AllegroSignal Integrity/Power IntegrityEDA vendor collaborationProgramming in PythonProgramming in SKILLProgramming in TCLCommunication skills

Required

An Electrical Engineering degree or equivalent
Experience with 2.5D and 3D package systems and their SI/PI requirements
10+ years of recent experience in the use of Cadence APD & Allegro toolsets
Facilitate standardization by being aware of the bigger picture, including design features which will drive standardization and improve efficiency throughout the department

Preferred

Familiarity with EDA vendor collaboration, tool evaluation, and issue resolution
Strong verbal, written communication and presentation skills
Programming experience in Python, SKILL, or TCL Able to optimize design methodologies in packaging design

Company

Arm’s foundational technology is defining the future of computing. A future built by the greatest technology ecosystem in the world.

H1B Sponsorship

Arm has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (295)
2024 (166)
2023 (164)
2022 (123)
2021 (103)
2020 (133)

Funding

Current Stage
Public Company
Total Funding
unknown
2016-07-18Acquired
1999-01-15IPO

Leadership Team

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Rene Haas
CEO
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Jason Child
EVP & CFO
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Company data provided by crunchbase