Arm · 6 days ago
Principal Package Layout Engineer
Arm is seeking a Principal Package Layout Engineer to join their System-in-Package team. This role involves defining, designing, and verifying package designs for next-generation SoCs in IoT, Automotive, and Compute spaces, while collaborating with various teams and external vendors.
AnalyticsElectronicsInternet of ThingsSemiconductorSoftware
Responsibilities
Layouts using best-known practices for DFM, DFA, Signal and Power Delivery Networks
Work with minimal supervision and approach challenges with enthusiasm and persistence
Bring forward ideas to improve overall team efficiency
Communicate and coordinate with external vendors as necessary
Qualification
Required
An Electrical Engineering degree or equivalent
Experience with 2.5D and 3D package systems and their SI/PI requirements
10+ years of recent experience in the use of Cadence APD & Allegro toolsets
Facilitate standardization by being aware of the bigger picture, including design features which will drive standardization and improve efficiency throughout the department
Preferred
Familiarity with EDA vendor collaboration, tool evaluation, and issue resolution
Strong verbal, written communication and presentation skills
Programming experience in Python, SKILL, or TCL Able to optimize design methodologies in packaging design
Company
Arm
Arm’s foundational technology is defining the future of computing. A future built by the greatest technology ecosystem in the world.
H1B Sponsorship
Arm has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (295)
2024 (166)
2023 (164)
2022 (123)
2021 (103)
2020 (133)
Funding
Current Stage
Public CompanyTotal Funding
unknown2016-07-18Acquired
1999-01-15IPO
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