Senior Engineer Compact Modeling jobs in United States
cer-icon
Apply on Employer Site
company-logo

Rapidus Corporation · 1 day ago

Senior Engineer Compact Modeling

Rapidus Corporation is focused on delivering high-quality Process Design Kits (PDKs) to customers. They are seeking a Senior Engineer in Compact Modeling to develop and maintain device model code and infrastructure for circuit simulation, supporting advanced products in artificial intelligence, high-performance computing, and mobile domains.

ElectronicsManufacturingProduct DesignProduct ResearchSemiconductor
Hiring Manager
Robin Philippe
linkedin

Responsibilities

Develop and maintain compact/SPICE device models using industry-standard simulation tools
Support PDK development by implementing accurate and scalable models for advanced devices
Collaborate with technology development teams to define test structures for model extraction and silicon correlation
Perform model validation across a wide range of design conditions, including corner cases
Partner closely with cross-functional teams within Rapidus to deliver production-quality IP and PDK deliverables

Qualification

Semiconductor device physicsSPICE-level modelingCircuit simulationProgramming in PythonProgramming in C/C++Programming in PerlModel validationCollaboration skills

Required

Master's degree in Electrical Engineering or a related STEM field
5+ years of relevant experience, including:
Semiconductor device physics and modeling
Programming in Python, Perl, and/or C/C++
Circuit simulation and compact model development (e.g., BSIM, PSP)
Experience with SPICE-level device modeling or circuit design

Company

Rapidus Corporation

twittertwitter
company-logo
半導体を通して人々を幸せに、豊かにし、人生を充実したものにすることを目指し、イノベーションの創出、人材育成、真にグリーン化に取り組む最先端ロジック半導体製造メーカーRapidusの公式アカウントです。 事業内容: 1.半導体素子、集積回路等の電子部品の研究、開発、設計、製造及び販売 2.環境に配慮した省エネルギーの半導体及び半導体製造技術の研究、開発 3.半導体産業を担う人材の育成・開発

Funding

Current Stage
Late Stage
Total Funding
$2.31B
Key Investors
Honda MotorMinistry of Economy, Trade, and Industry
2025-06-10Corporate Round· $6.92M
2023-04-10Grant· $2.25B
2022-11-11Grant· $52.59M

Leadership Team

leader-logo
Rozalia Beica
Field CTO Packaging Technologies
linkedin
leader-logo
Henri Richard
President & General Manager
linkedin
Company data provided by crunchbase