Intellectual Property Engineer jobs in United States
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Rapidus Corporation · 1 day ago

Intellectual Property Engineer

Rapidus Corporation is seeking a technically skilled and highly organized IP Vendor Manager or Senior Engineer to manage the development and delivery of semiconductor IPs for their advanced 2nm technology platform. The successful candidate will lead vendor selection, contract negotiation, and overall vendor performance management while collaborating with internal teams.

ElectronicsManufacturingProduct DesignProduct ResearchSemiconductor
Hiring Manager
Robin Philippe
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Responsibilities

Identify, evaluate, and select IP vendors for Interface, Sensor, Analog, and Foundation IPs
Negotiate development contracts and manage vendor relationships from initiation through final acceptance
Monitor development progress and ensure on-time delivery of high-quality, PDK-aligned IPs
Conduct technical reviews and verify IP deliverables in collaboration with internal engineering teams
Manage change requests, issue resolution, and interface with cross-functional departments for alignment
Maintain accurate project documentation and vendor performance metrics
Work closely with internal stakeholders including technology, design enablement, QA, and operations

Qualification

Semiconductor IP developmentVendor managementAnalog/mixed-signal designSerDesUCIeStandard cell librariesCommunication skillsOrganizational skills

Required

Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related discipline
Solid understanding of semiconductor IP development, especially for advanced nodes (5nm and below)
5+ years of experience in IP development, IP integration, or vendor management
Technical knowledge in areas such as SerDes, UCIe, analog/mixed-signal design, standard cell libraries
Strong communication and organizational skills, with experience working across multiple departments

Company

Rapidus Corporation

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半導体を通して人々を幸せに、豊かにし、人生を充実したものにすることを目指し、イノベーションの創出、人材育成、真にグリーン化に取り組む最先端ロジック半導体製造メーカーRapidusの公式アカウントです。 事業内容: 1.半導体素子、集積回路等の電子部品の研究、開発、設計、製造及び販売 2.環境に配慮した省エネルギーの半導体及び半導体製造技術の研究、開発 3.半導体産業を担う人材の育成・開発

Funding

Current Stage
Late Stage
Total Funding
$2.31B
Key Investors
Honda MotorMinistry of Economy, Trade, and Industry
2025-06-10Corporate Round· $6.92M
2023-04-10Grant· $2.25B
2022-11-11Grant· $52.59M

Leadership Team

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Rozalia Beica
Field CTO Packaging Technologies
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Henri Richard
President & General Manager
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