Rapidus Corporation · 1 day ago
Senior Package Engineer
Rapidus Corporation is seeking a Senior Package Engineer to provide expert technical support for assembly and test development focused on advanced chiplet and multi-die packaging. The role involves collaborating with customers and cross-functional teams to clarify technical requirements and resolve design issues while developing clear technical documentation.
Responsibilities
Provide expert technical support for assembly and test development with a focus on advanced chiplet and multi-die packaging
Partner with customers to clarify technical requirements, align specifications, and resolve design and integration issues
Guide interposer design, multi-die integration, and system-level packaging considerations
Collaborate with cross-functional teams across design, development, test, and packaging to overcome technical challenges
Develop and deliver clear, well-structured technical documentation and presentations for both internal stakeholders and customers
Qualification
Required
Proven hands-on experience in 2.5D / 2.xD / 3D chiplet or multi-die packaging design
Strong knowledge of interposer design and advanced packaging technologies
Familiarity with system-level validation, test methodologies, and productization processes
Demonstrated ability to work directly with customers and collaborate across diverse technical teams
Preferred
Expertise in high-bandwidth interconnects, HBM integration, or multi-chip module design
Understanding of thermal management, signal integrity (SI), and power distribution in advanced packaging
Experience in customer-facing technical roles and/or technical program management
Company
Rapidus Corporation
半導体を通して人々を幸せに、豊かにし、人生を充実したものにすることを目指し、イノベーションの創出、人材育成、真にグリーン化に取り組む最先端ロジック半導体製造メーカーRapidusの公式アカウントです。 事業内容: 1.半導体素子、集積回路等の電子部品の研究、開発、設計、製造及び販売 2.環境に配慮した省エネルギーの半導体及び半導体製造技術の研究、開発 3.半導体産業を担う人材の育成・開発
Funding
Current Stage
Late StageTotal Funding
$2.31BKey Investors
Honda MotorMinistry of Economy, Trade, and Industry
2025-06-10Corporate Round· $6.92M
2023-04-10Grant· $2.25B
2022-11-11Grant· $52.59M
Leadership Team
Recent News
Straits Times
2025-12-31
2025-12-30
2025-12-26
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