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MACOM · 1 day ago

Photonics Mechanical Design Engineer, Senior

Hamilton Township, NJ

Full-time

Onsite

Senior Level, Lead/Staff

10+ years exp

MACOM is a semiconductor company specializing in products for Data Center, Telecommunication, and Industrial and Defense applications. The Senior Photonics Mechanical Design Engineer will serve as a technical lead for new product introductions, focusing on developing mechanical solutions for RF and photonics products, while collaborating with various internal and external teams to ensure successful product development and manufacturing processes.

ElectronicsIndustrialInformation TechnologyInternetMachinery ManufacturingManufacturingSemiconductorTechnical SupportWireless

No H1B

Security Clearance Required

U.S. Citizen Only

Responsibilities

Technical lead for developing mechanical/manufacturing solutions in RF and photonics module and enclosure development

Work with internal Product Design, QA, Reliability, Supply chain and external suppliers to develop, apply and qualify the appropriate packaging technologies and assembly processes, with focus on cost, manufacturability, yield, and quality

Work with Design, Program Management and Material Planning to plan and establish Engineering Build Requirements and Qualification Build Requirements for new product introductions

Collaborate with vendors and internal engineering resources to establish and update design rules for packaging

Perform design reviews to ensure adherence to DFM guidelines

Establish and implement robust assembly processes internally and at contract manufacturers

Working with Quality organization, characterize failure modes and analyze as a function of packaging materials and processes. Troubleshoot packaging and assembly defects, then define and implement solutions

Design/Develop tooling for high volume, high mix processes

Establish application notes for new products

Qualification

Photonics packagingRF design experienceFinite Element Analysis (FEA)Computational Fluid Dynamics (CFD)Six Sigma methodologiesAutoCADSolidWorksProject ownershipTeamwork skillsCommunication skills

Required

MS or BS in Mechanical Engineering or similar studies

Minimum of 10 years of experience in relevant design engineering with process development and design/emphasis on electronic assemblies

Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position

Must be able to obtain a security clearance

Knowledge of high-volume RF and photonics packaging assembly/test processes

In depth understanding of a variety of optical networking devices such as lasers, modulators, detectors, WDM, optical fibers, and control electronics

Experience in successfully driving design/development/characterization activities from concept to implementation

Ability to lead independent process development efforts and provide suppliers direction by working with design, assembly, and quality organizations

Experience with solving steady state and dynamic thermal and mechanical problems, using finite element analysis (FEA) and computational fluid dynamics (CFD) software

Knowledge of product characterization, testing, quality, and reliability, including compliance testing and certification

Experience in process troubleshooting, failure analysis and Six Sigma methodologies

Ability to work under tight deadlines, with strong ownership of projects

Ability to work effectively in a multi-project mode

Good written and verbal communication skills. Able to present ideas, design concepts, data and plans with high confidence at team meetings and business group review meetings

Good teamwork skills in working together to achieve goals