Cisco · 1 month ago
Silicon Photonics Packaging Technical Leader (HYBRID) 2000935
San Jose, California, US
Full-time
Hybrid
Senior Level
$169K/yr - $241K/yr
7+ years expCisco is seeking a seasoned Silicon Photonics Packaging Technical Leader to lead the development and integration of advanced packaging solutions for silicon photonics products. This role involves close collaboration with design engineering, operations, and supply chain teams to innovate in packaging technologies and manage technical challenges on a global scale.
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Responsibilities
Serve as the primary technical interface with Outsourced Semiconductor Assembly & Test (OSAT) and key component partners, driving assembly, test, and qualification for silicon photonics packages
Proactively identify and mitigate risks, resolve highly complex assembly issues, and establish best-in-class quality and reliability standards across the supply chain
Work collaboratively with design teams to influence package architecture and provide expert guidance on DfM, DfR contributing to the definition of critical process parameters for HVM. Engage deeply in substrate & PCB design, materials selection, and reviews
Collaborate closely with internal and external teams to optimize packaging solutions for performance, cost, and manufacturability
Present technical findings and recommendations to cross-functional teams and stakeholders
Stay informed on emerging packaging technologies and industry trends, contributing to the evaluation of new materials, processes, and architectures
Mentor and guide junior engineers, fostering technical excellence and innovation within the team
Qualification
Required
MS or PhD in Mechanical Engineering, Electrical Engineering, Physics, Materials Science, or a related field, in combination with 7+ years of progressive experience in Photonics or Semiconductor Packaging Industry
Proven experience in advanced package assembly and integration and package reliability qualification
Understanding of package design & architecture, including substrate design and fabrication
Expertise in advanced problem-solving methodologies (e.g., 8D, FMEA, statistical process control) and data analysis skills
Knowledge and experience in physical failure analysis
Preferred
Experience in Silicon Photonic packaging and/or co-packaged optics is a plus
Familiarity with volume manufacturing
Exceptional ability to work within and lead projects with highly cross-functional and geographically distributed technical teams
Strong communication, data presentation, and influencing skills, capable of articulating technical concepts clearly to diverse audiences
Willingness to learn and evolve professionally
Experience with Advanced Packaging technologies such as 2.5D/3D, TSV, flip-chip, stacking, hybrid integration
Benefits
Medical, dental and vision insurance
A 401(k) plan with a Cisco matching contribution
Paid parental leave
Short and long-term disability coverage
Basic life insurance
10 paid holidays per full calendar year
1 floating holiday for non-exempt employees
1 paid day off for employee’s birthday
Paid year-end holiday shutdown
4 paid days off for personal wellness determined by Cisco
16 days of paid vacation time per full calendar year
Flexible vacation time off program
80 hours of sick time off provided on hire date
Up to 80 hours of unused sick time carried forward
Additional paid time away may be requested to deal with critical or emergency issues for family members
Optional 10 paid days per full calendar year to volunteer
Annual bonuses subject to Cisco’s policies
Company
Cisco
Cisco develops, manufactures, and sells networking hardware, telecommunications equipment, and other technology services and products. It is a sub-organization of Cisco Press.
10001+ employees
H1B Sponsorship
Cisco has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (1238)
2024 (1231)
2023 (1273)
2022 (2127)
2021 (1991)
2020 (1173)
Funding
Current Stage
Public CompanyTotal Funding
unknown1990-02-13IPO
Leadership Team
Chuck Robbins
Chair and CEO
Carl Solder
Chief Technology Officer - Cisco System Australia/New Zealand
Recent News
2026-01-08
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2026-01-07
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