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MACOM · 2 days ago

Assembly Engineer

Morgan Hill, CA

Full-time

Onsite

Entry, Mid Level

$69K/yr - $113K/yr

1+ years exp

MACOM designs and manufactures semiconductor products for various applications. The Assembly Engineer will support new product introductions, develop mechanical solutions, and collaborate with teams to ensure quality and manufacturability of products.

ElectronicsIndustrialInformation TechnologyInternetMachinery ManufacturingManufacturingSemiconductorTechnical SupportWireless

No H1B

U.S. Citizen Only

Responsibilities

Support new product introductions from concept through production release, providing critical mechanical design input for RF power and photonics products

Develop mechanical/manufacturing solutions for module and enclosure, focusing on cost, volume manufacturability, yield, and quality. Collaborate with internal design, QA, reliability, supply chain, and external suppliers to qualify new equipment, technologies and assembly processes

Plan and establish engineering build requirements for new product introductions

Perform design reviews to ensure adherence to DFM guidelines and update design rules as required

Create and maintain mechanical design drawings, specifications, and 3D models using SolidWorks and AutoCAD

Generate technical documentation, including design reports, test reports, datasheets, and bills of materials

Develops, implements and maintains methods, operation sequence and processes in the assembly manufacturing

Maintains records such as yield report and reporting system for coordination of manufacturing operations

Drive improvement in terms of yield and cost saving

Interface with design engineering team in coordinating the release of new products

Responsible for documentation management and an understanding of good manufacturing practices. Uses appropriate tools and performs integrity analysis of packaging

Work with internal product design, QA, Reliability, Failure Analysis, supply chain, and the external suppliers to develop and qualify the appropriate packaging technologies and assembly processes, with focus on cost, high volume manufacturability, yield and quality

Implement and improve robust assembly processes internally and at our contract manufacturers

Qualification

Mechanical designSolidWorksAutoCAD3D printingManufacturing technologiesSMTPCB layoutCommunication skillsProblem-solving skillsTeam playerOrganizational skills

Required

min. Bachelor Degree in Engineering

1–5 years of experience in mechanical design, preferably in semiconductor or electronics packaging

Mature, highly responsible, a good team player with good presentation skills

Fluent in spoken and written English. Must be US person

Strong analytical, problem-solving, and communication skills

Ability to work independently and collaboratively in a fast-paced, result-oriented environment

Strong organizational skills and proficiency in Excel, Word, and PowerPoint

Preferred

Expertise in 2D AutoCAD and 3D SolidWorks (or similar CAD software)

3D printing for fast prototyping and design verification combined with good mech skills to build prototypes. (able to handle cutting laser and horizonal mill is a plus)

Knowledge of manufacturing technologies for packaging electronics, including machining metals, plastic injection molding, and additive manufacturing (3D printing)

Familiarity with semiconductor assembly equipment (SMT, die attach, wire bonding, molding) is a plus

Experience with SMT and PCB layout design and related software (e.g., Cadence) is a plus

Experience with FEA tools (e.g. ANSYS) is a plus

Knowledge of thermal management design for electronics is a plus