Lam Research · 1 day ago
Senior Field Service Engineer
Hillsboro, OR
Full-time
Hybrid
Senior Level
5+ years expLam Research is focused on providing premier customer support throughout their lifecycle. As a Senior Field Service Engineer, you will be responsible for the installation, maintenance, and troubleshooting of Lam's semiconductor equipment, ensuring high-quality service to customers at their sites.
CleanTechManufacturingSemiconductor
Responsibilities
Install and/or relocate equipment at customers’ sites. Conduct associated start-up, cut over and check-out activities on the newly installed systems
Provide warranty tool support or paid service for out-of-warranty tool by performing on-site preventive maintenance of equipment and attending to equipment abnormalities. Coordinate all service actions with customer to minimize downtime or system interruptions
Apply troubleshooting techniques to eliminate equipment malfunctions. Conduct diagnostic procedures to isolate problem. Assess severity of malfunctions and determine corrective actions required or escalate for assistance and prompt resolution. When necessary, replace defective units, components, or parts where appropriate
Implement field modifications or updates as released in Engineering Change Orders (ECOs) which may involve removal and installation of assemblies, sub-assemblies, systems, and subsystems
Carry out Tier 2 process qualification work
Prepare and maintain accurate logs, service records, part usage documentation, diagnostic updates, and other management reports
Professionally represent the company to the customer. Utilize knowledge of company’s product lines and services to keep existing / potential customers informed when new/additional needs are identified
Develop good customer relations during installation and execution of service contracts
Maintain company’s assigned equipment (computer, tool kit, diagnostic test equipment, spare parts, etc.) in good working condition, and ensure it is secure and accounted for
Take on ad-hoc duties as and when assigned by the Immediate Supervisor
Qualification
Required
Bachelor's degree in Electronics, Engineering, or related field and 5+ years of experience; or Master's degree with 3+ years; or equivalent work experience
Previous experience in installation, maintenance, repair, or troubleshooting of semiconductor capital equipment
Self-starter who can work independently and has a deep desire to learn and grow with the Company
Strong interpersonal and communication skills
Able to actively engage customers on technical solutions
Willing to support short term, overseas assignment
Able to work swing shift (Tues – Sat and/or Wed – Sun)
Proficiency in interpreting electrical and mechanical schematics, diagrams, and operation manuals
Able to work in a clean room environment while wearing personal protective safety equipment, or cleanroom suit
Frequently position oneself (e.g., bend, stoop, reach, walk, sit, twist, squat, kneel, climb, stand) to perform job tasks for extended periods
Able to travel frequently, domestically and internationally, based on customer needs, flexibility to work a variety shifts including compressed and alternative workweeks including overtime and on-call if needed
Able to perform rostered 24/7 on call standby duty for a week
Preferred
Proficiency in basic computer skills and familiarity with common office software including Microsoft Office Suite
Communication skills, both written and verbal, in English
Foundational analytical and problem-solving skills
Company
Lam Research
Lam Research supplies wafer fabrication equipment and services to the worldwide semiconductor industry.
10001+ employees
H1B Sponsorship
Lam Research has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (242)
2024 (239)
2023 (170)
2022 (216)
2021 (242)
2020 (182)
Funding
Current Stage
Public CompanyTotal Funding
unknown1984-05-11IPO
Leadership Team
Tim Archer
President and CEO
Rick Gottscho
Exec VP and CTO
Recent News
2026-01-05
2025-12-30
Company data provided by crunchbase