Intel Corporation · 1 day ago
Packaging Module Development Engineer
US, Arizona, Phoenix
Full-time
Onsite
Entry Level
$134K/yr - $189K/yr
1+ years expIntel Corporation is a leader in semiconductor technology, and they are seeking a Packaging Module Development Engineer to contribute to the advancement of packaging technologies. The role involves developing interconnect and thermal solutions, collaborating with teams to optimize assembly processes, and managing projects to meet development timelines.
Semiconductors
Responsibilities
Developing First Level/Second Level Interconnect (FLI/SLI) and Thermal solutions to support Intel’s future packaging platforms
Collaborating with multifunctional and cross-organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability
Innovating next generation materials, equipment, and fabrication processes to enhance semiconductor packaging capabilities at scale
Managing projects to meet product development timelines
Applying formal education and judgment to solve technical problems
Providing sustaining support for equipment performance and process health in high-volume manufacturing
Responding promptly to foundry customer requests and events
Qualification
Required
PhD with one or more years in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or a related field
Minimum GPA of 3.5
At least one publication in a peer-reviewed technical journal
Must have the required degree prior to your start date
Preferred
One or more years of experience in technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE)
Delivering results for complex, time-critical technical projects
Semiconductor fabrication processes and technology
Previous related work experience in a semiconductor foundry
Benefits
Competitive pay
Stock
Bonuses
Health
Retirement
Vacation
Company
Intel Corporation
Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside.
10001+ employees
H1B Sponsorship
Intel Corporation has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2793)
2024 (3717)
2023 (3576)
2022 (4811)
2021 (3359)
2020 (1174)
Funding
Current Stage
Late StageLeadership Team
Brea Watts, MFA
Communications Manager, CEO
Carol Bartz
CEO
Recent News
Company data provided by crunchbase