Nokia · 4 days ago
Photonics Hybrid Integration Engineer
520 Almanor Avenue, Sunnyvale, California, 94085-3533, US
Full-time
Hybrid
Mid, Senior Level
$139K/yr - $259K/yr
3+ years expNokia is a global leader in connectivity for the AI era, and they are seeking a talented Photonics Hybrid Integration Engineer to lead the development of next-generation Silicon Photonics solutions. In this role, you will drive the optimization and scaling of fabrication processes for an advanced heterogeneously integrated silicon-photonics platform while collaborating with cross-functional teams to ensure a smooth transition to mass production.
ElectronicsEnterprise SoftwareInternet of ThingsMobile DevicesTelecommunications
Responsibilities
Explore, define, and optimize next-generation wafer- and package-level fabrication processes for a high-performance Silicon photonics platforms, including hybrid/heterogeneous integration of exotic materials, using advanced packaging technologies
Lead the next generation hybrid silicon photonic design in collaboration with cross-functional teams, stakeholders and vendors to ensure package and performance requirements are met
Survey advanced Photonic solutions, materials and vendors to stay current with new technological advancements
Own and maintain the process and the manufacturing documentation, along with Bill of Materials for new products
Drive package debug activities during product validation and qualification
Conduct root cause analysis and implement solutions to achieve high yield targets
Support the development activities at our Contract Manufacturers, both remotely and on-site to ensure a smooth transition to mass production
Qualification
Required
3-5 years of experience in integrated photonics, semiconductors, or microelectronics fabrication
Expertise in Silicon photonics, TFLN, BTO, etc…
Experience with wafer fab manufacturing processes, such as lithography, PVD/CVD/ALD, wet/dry etch, CMP
Experience with W2W and D2W bonding
Track record in developing and optimizing new nanofabrication processes
Strong problem-solving skills and ability to analyze complex data sets
Experience with documentation of fabrication, inspection, and assembly processes
Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively
Experience with package and process design/development from design to production
Experience with metrology techniques such as SEM/XSEM, confocal microscopy, acoustic imaging, AFM, RI characterization
Preferred
Expertise with advanced packaging (3D, 2.5D) technologies
Experience with RF/high-speed electronics and signal integrity
Experience in microelectronics, optoelectronics packaging design and assembly
Familiar with flip chip, BGA, PCBA, Flex design reliability and processing
Experience interfacing with wafer fabs and OSATs
Benefits
Corporate Retirement Savings Plan
Health and dental benefits
Short-term disability, and long-term disability
Life insurance, and AD&D – Company paid 2x base pay
Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
Paid time off for holidays and Vacation
Employee Stock Purchase Plan
Tuition Assistance Plan
Adoption assistance
Employee Assistance Program/Work Life Resource Program
Company
Nokia
Nokia manufactures mobile devices, network infrastructure, and location-based technology for businesses. It is a sub-organization of Enscryb.
10001+ employees
H1B Sponsorship
Nokia has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (262)
2024 (264)
2023 (259)
2022 (250)
2021 (296)
2020 (287)
Funding
Current Stage
Public CompanyTotal Funding
$4.45BKey Investors
European Investment BankNVIDIANational Telecommunications and Information Administration
2025-12-16Post Ipo Debt· $511.84M
2025-10-28Post Ipo Equity· $1B
2025-06-30Post Ipo Debt· $1.76B
Leadership Team
Justin Hotard
President and CEO
Victoria Hanrahan
Chief of Staff to the CEO
Recent News
2026-01-09
2026-01-09
Mobile World Live
2026-01-09
Company data provided by crunchbase