Texas Instruments · 3 days ago
Analog IC Design Engineering Intern - AI Assisted RFIC Design
EXKI 13560 N. Central Expwy, Dallas, TX, 75243, US
Internship
Onsite
InternTexas Instruments is a global semiconductor company that designs and manufactures analog and embedded processing chips. The RF Design Intern role involves utilizing machine learning approaches to design RF and mmWave circuits, as well as creating various passive and active microwave components.
ComputerDSPSemiconductor
Responsibilities
Utilizing machine learning based approaches to designing RF and mmWave circuits
Training data generation, neural network training and inverse design synthesis using supervised/unsupervised and reinforcement learning
Design of intuitive and non intuitive passive microwave components such as matching circuits, filters, hybrid couplers, Wilkinson dividers and power combiners
Design of intuitive and non intuitive active circuits such as Power Amplifiers, Low Noise Amplifier, phase shifters and mixers
Qualification
Required
Currently pursuing Masters or PhD degree in Electrical Engineering or related field with RF/mmWave background and AI/ML experience
Cumulative 3.0/4.0 GPA or higher
Preferred
Strong background in coding & scripting using python and deep learning using PyTorch or TensorFlow
Experience with electromagnetic simulators such as HFSS, EMX, Helic or Momentum
Prior tape out experience of RFIC designs on CMOS, SiGe or III-V
Knowledge of prototype development, lab testing and debug
Benefits
Competitive pay and benefits designed to help you and your family live your best life
Company
Texas Instruments
Texas Instruments is a global semiconductor company that manufactures, designs, tests, and sells embedded and analog processing chips.
Founded in 1930
10001+ employees
H1B Sponsorship
Texas Instruments has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (189)
2024 (184)
2023 (148)
2022 (222)
2021 (165)
2020 (179)
Funding
Current Stage
Public CompanyTotal Funding
$13.61BKey Investors
U.S. Department of Commerce
2025-05-20Post Ipo Debt· $1.2B
2024-12-20Grant· $1.61B
2024-05-28Post Ipo Equity· $2.5B
Leadership Team
Richard Templeton
President and Chief Executive Officer
Krunali Patel
Senior vice president and chief information officer
Recent News
2026-01-07
Company data provided by crunchbase