Principal Memory Design Engineer, HBM jobs in United States
cer-icon
Apply on Employer Site
company-logo

Micron Technology · 3 days ago

Principal Memory Design Engineer, HBM

Micron Technology is a world leader in innovating memory and storage solutions. The Principal Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits, leading layout processes, and ensuring robust verification and reliability while collaborating cross-functionally to support manufacturability and drive innovation for future memory generations.

ComputerHardwareManufacturingSemiconductor
check
H1B Sponsor Likelynote

Responsibilities

Design and implement DRAM circuits, including digital, analog, and memory core circuitry, based on device specifications
Create and optimize floorplans for circuit placement, signal routing, power delivery, sense margins, timings, and die size
Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, speed, and reliability
Model parasitics in simulation, verify routing and power integrity, and support validation, reticle experiments, and tape-out revisions
Confirm simulation-to-silicon correlation and recommend schematic edits
Contribute to documentation, training, standardization efforts, and cross-group communication
Manage build and layout resources, monitor task progress, and lead technical reviews
Serve as a primary contact for design, layout, verification, and testing while preparing project status reports

Qualification

DRAM circuit designCadence VirtuosoFINESIMHSPICEVERILOGCMOS Circuit DesignVLSIAnalog Circuit DesignProblem-solvingCommunication skillsInterpersonal skills

Required

Coursework in CMOS Circuit Design, VLSI, and Analog Circuit Design, with knowledge of device reliability
Expertise in Cadence Virtuoso, physical layout, and circuit floor planning
Experience with FINESIM, HSPICE, and VERILOG simulation tools
Strong analytical and problem‑solving abilities with significant technical contributions and innovation history
Deep expertise in DRAM subsystem architecture, specification, operation, or design, including cross‑department technical leadership

Preferred

Highly self‑motivated with strong problem‑solving instincts and a passion for discovering new solutions
In‑depth awareness of industry‑specific technologies and trends
Excellent communication and interpersonal skills

Benefits

Choice of medical, dental and vision plans
Benefit programs that help protect your income if you are unable to work due to illness or injury
Paid family leave
Robust paid time-off program
Paid holidays

Company

Micron Technology

company-logo
Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips.

H1B Sponsorship

Micron Technology has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (573)
2024 (429)
2023 (299)
2022 (626)
2021 (564)
2020 (538)

Funding

Current Stage
Public Company
Total Funding
$8.9B
Key Investors
U.S. Department of Commerce
2025-04-24Post Ipo Debt· $1.75B
2025-01-16Post Ipo Debt· $1B
2024-04-18Grant· $6.1B

Leadership Team

leader-logo
Sanjay Mehrotra
Chairman, President & CEO
linkedin
leader-logo
Gursharan Singh
Senior Vice President BE Operations
linkedin
Company data provided by crunchbase