Semiconductor Packaging Engineer jobs in United States
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Twin City Staffing · 6 days ago

Semiconductor Packaging Engineer

Twin City Staffing is seeking two talented and motivated wafer fab process engineers with a focus on advanced semiconductor packaging to join their cutting-edge fabrication team. In this role, you’ll work on the forefront of 3D chip stacking and flip-chip hybridization, contributing directly to breakthrough innovations in device performance and packaging efficiency.

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Responsibilities

Operate chip stacking and hybridization equipment (FC-150, FC-300) for flip-chip 3D processes
Run and support fab tools like evaporation, sputtering, or RIE as needed
Perform process QC to maintain high yield and product quality
Document, troubleshoot, and improve processes
Work with engineering teams to scale operations and build future team capability

Qualification

Semiconductor packagingFlip-chip technology3D chip stackingDeposition equipmentEtch equipmentProcess QCTroubleshootingDocumentationTeam collaboration

Required

Bachelor's or Master's in Physics or Engineering

Preferred

Experience with deposition or etch equipment
Flip-chip or 3D packaging experience

Benefits

Health, dental, vision, life, and disability insurance
401(k)
Scheduled raise/salary review
Company parties

Company

Twin City Staffing

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Twin City Staffing is an employment and staffing agency.

Funding

Current Stage
Late Stage
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