Micron Technology · 1 day ago
MTS Process Integration Engineer, APTD
Boise, ID - Main Site
Full-time
Onsite
Senior Level, Lead/Staff
10+ years expMicron Technology is a world leader in innovating memory and storage solutions. As a Process Integration Engineer for Advanced Packaging, you will own the end-to-end integration of next-generation package architectures and lead new technology development while coordinating across various teams to deliver high-performance multi-die technology.
ComputerHardwareManufacturingSemiconductor
Responsibilities
Own package-level process integration across 2.5D/3D flows (wafer-to-wafer, chip-to-wafer, advanced interconnects), defining specs and process windows that meet high performance targets for HPC/AI products
Develop and integrate semiconductor manufacturing processes; Design, optimize, and implement fabrication flows that seamlessly integrate multiple steps (lithography, etch, deposition, diffusion, CMP, and thin films) into cohesive production processes
Plan, run, and analyze targeted experiments to validate new materials, process parameters, and design rules to improve yield and device performance. Design and execute DOEs on bonding, underfill, molding, stacking, and integration steps; Apply SPC to parametrics and yield detractors and close the loop with corrective actions
Analyze yield, performance, and defect data. Utilize big data, physical, electrical, and defect data to root-cause process weaknesses, yield issues, and tool variances. Employ SPC and advanced analytics
Lead technology transfer from TD to TD and HVM. Establish mask rules, materials, tool readiness, baseline qualification, and technology validation plans
Hybrid bonding (CuCu + dielectric) integration; Set surface prep, planarity and alignment requirements, qualify W2W/C2W flows, and track defectivity and reliability
Thermocompression & microbump flows; Optimize underfill, TC bonding windows, and pillar/bump geometries for high I/O assemblies
HBM and interposer systems; Co-optimize TSV/interconnect routing and thermal paths to meet bandwidth/latency targets. Align package floorplans with chiplet partitioning
Warpage engineering; Predict and mitigate wafer/die warpage via modeling, cure shrinkage controls, and material/process levers. Validate with inline metrology
Metrology and inspection; Deploy SAM, IR microscopy, and emerging XRD warpage mapping to correlate process, defects, and reliability
Qualification
Required
MS or PhD in Materials Science, Chemical Engineering, or related field
10+ years experience in advanced packaging technology development (2.5D/3D, HBM)
Hands-on knowledge of advanced interconnects/TSV, die stacking, underfill, molding, and bonding flows
Proficiency in DOE/SPC and data analysis (e.g., JMP/Minitab/Python); demonstrated root-cause problem solving and yield improvement
Experience with metrology: SAM, Xray/CT, IR, warpage profilers (shadow moiré/DIC)
Strong communication skills; ability to lead cross-functional teams and drive actions to closure in fast-paced environments
Direct experience with hybrid bonding integration and reliability (W2W/C2W)
Demonstrated success in HBM and logic integration (including thermal co-optimization)
Warpage modeling and inline correlation experience
Deep familiarity with underfills, reworkable strategies, and TC bonding optimization
Candidates must have experience and the ability to adhere to cleanroom environment/EHS protocols
Benefits
Choice of medical, dental and vision plans
Benefit programs that help protect your income if you are unable to work due to illness or injury
Paid family leave
Robust paid time-off program
Paid holidays
Company
Micron Technology
Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips.
10001+ employees
H1B Sponsorship
Micron Technology has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (573)
2024 (429)
2023 (299)
2022 (626)
2021 (564)
2020 (538)
Funding
Current Stage
Public CompanyTotal Funding
$8.9BKey Investors
U.S. Department of Commerce
2025-04-24Post Ipo Debt· $1.75B
2025-01-16Post Ipo Debt· $1B
2024-04-18Grant· $6.1B
Leadership Team
Sanjay Mehrotra
Chairman, President & CEO
Gursharan Singh
Senior Vice President BE Operations
Recent News
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