Cisco · 1 day ago
Semiconductor Packaging Technical Leader (HYBRID) 2000933
San Jose, CA
Full-time
Hybrid
Senior Level
$169K/yr - $241K/yr
7+ years expCisco is seeking a seasoned Semiconductor Packaging Technical Leader to work on advanced packaging technology and quality for their cutting-edge network processors, ASICs, and other semiconductor components. This role will provide technical leadership while collaborating with internal design and component engineering teams as well as a top-tier global supply chain.
Communications InfrastructureEnterprise SoftwareHardwareSoftware
Responsibilities
Serve as a technical expert for advanced packaging technologies (2.5D/3D, heterogeneous integration, large body packaging, MCM, flip-chip) providing guidance and problem-solving expertise in areas such as package design, materials, process development, assembly, and reliability
Work with top-tier package assembly partners to develop and implement semiconductor packaging and assembly solutions, ensuring alignment with product requirements and roadmaps
Work collaboratively with internal teams to guide Design for Manufacturability and Design for Reliability from a packaging perspective
Provide cross-functional technical leadership to proactively identify and mitigate risks, resolve highly complex assembly issues, silicon-to-package interaction, system-level integration and establish best-in-class quality and reliability standards across the supply chain
Contribute to evaluation of new packaging technology, materials and processes, for Cisco product design and implementation
Drive and support packaging-related quality initiatives including PCN qual process and failure analysis (FA), implementing corrective actions (8D), and ensuring adherence to quality standards
This is a critical role where you will directly influence the technical direction and successful delivery of Cisco’s advanced products by driving innovative packaging and assembly solutions
Qualification
Required
BS/MS/PhD in Mechanical Engineering, Electrical Engineering, Materials Science, Physics or a closely related field
7+ years of progressive experience in Semiconductor Packaging and Assembly Industry, with demonstrated experience leading technical projects or initiatives
Proven experience in advanced package assembly and integration and package reliability qualification
Comprehensive knowledge and understanding of advanced packaging process (e.g. CoWoS, RDL Fan-out and silicon embedded) and materials
Good understanding of package design and material selection for thermal performance and signal/power integrity
Expertise in advanced problem-solving methodologies (e.g. 8D, FMEA, statistical process control) and data analysis skills
Preferred
Experience with volume manufacturing
Strong communication, presentation, and influencing skills, with the ability to articulate technical concepts clearly to diverse audiences
Working knowledge of advanced simulation tools for package design and reliability analysis
Familiar with photonics packaging and co-packaged optics is a plus
Willingness to learn and evolve professionally
Experience with Advanced Packaging technologies such as 2.5D/3D, TSV, flip-chip, stacking, hybrid integration
Familiar with advanced substrate manufacturing processes and materials
Benefits
Medical, dental and vision insurance
401(k) plan with a Cisco matching contribution
Paid parental leave
Short and long-term disability coverage
Basic life insurance
10 paid holidays per full calendar year
1 floating holiday for non-exempt employees
1 paid day off for employee’s birthday
Paid year-end holiday shutdown
4 paid days off for personal wellness determined by Cisco
16 days of paid vacation time per full calendar year
Flexible vacation time off program
80 hours of sick time off provided on hire date and each January 1st thereafter
Up to 80 hours of unused sick time carried forward from one calendar year to the next
Additional paid time away may be requested to deal with critical or emergency issues for family members
Optional 10 paid days per full calendar year to volunteer
Annual bonuses subject to Cisco’s policies
Performance-based Incentive Pay On Top Of Their Base Salary
Company
Cisco
Cisco develops, manufactures, and sells networking hardware, telecommunications equipment, and other technology services and products. It is a sub-organization of Cisco Press.
10001+ employees
H1B Sponsorship
Cisco has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (1238)
2024 (1231)
2023 (1273)
2022 (2127)
2021 (1991)
2020 (1173)
Funding
Current Stage
Public CompanyTotal Funding
unknown1990-02-13IPO
Leadership Team
Chuck Robbins
Chair and CEO
Carl Solder
Chief Technology Officer - Cisco System Australia/New Zealand
Recent News
The Hollywood Reporter
2026-01-07
Company data provided by crunchbase