Paradromics · 1 day ago
Senior Heterogeneous Integration Engineer
Austin, TX
Full-time
Onsite
Senior Level
5+ years expParadromics is building a brain-computer interface (BCI) platform that records brain activity at the highest possible resolution. The role involves bridging the gap between silicon microfabrication and complex systems, focusing on developing novel bonding processes and optimizing protocols for various bonding techniques.
BiotechnologyMedicalMedical DeviceNeuroscience
Responsibilities
Lead the development of novel bonding processes (wafer-to-wafer, die-to-wafer) involving dissimilar materials
Optimize protocols for various bonding processes including wafer bonding, diffusion bonding, laser bonding, and more, focusing on interface mechanics, intermetallic formation, and stress management
Use FEA tools (COMSOL, ANSYS) to model thermal dissipation and perform thermomechanical analysis in multi-material stacks
Oversee or execute cleanroom processes (lithography, deposition, etching) required to prepare surfaces for high-fidelity integration
Utilize SEM, TEM, CSAM, and mechanical pull-testing to validate bond quality and reliability under thermal cycling
Translate complex material requirements into specs for foundry partners or equipment vendors
Collaborate with Electrical Engineering and Electrode Manufacturing teams to support infrastructure and integration needs
Optimize development processes and translate them into manufacturing protocols
Qualification
Required
Ph.D. or M.S. in Materials Science, Applied Physics, Mechanical Engineering, or Electrical Engineering
5+ years of hands-on experience in heterogeneous integration or advanced packaging
Deep expertise in the physics and chemistry of adhesion and bonding with proven experience in at least two of the following: wafer bonding (fusion, anodic, eutectic), TLP (Transient Liquid Phase) bonding, or laser-assisted bonding
A portfolio of work demonstrating the integration of silicon devices with non-silicon materials (e.g., ceramics, glass, metals, polymers, or III-V semiconductors)
Proficiency in finite element analysis for thermal and structural mechanics
Hands-on cleanroom experiences, specifically regarding surface activation and planarization (CMP) for bonding
Hands-on experiences and knowledge with mechanical and electrical testing instruments, and building customized test setups
Preferred
Familiarity with the requirements and testing of hermetic packaging for MEMS
Familiarity with methods and instruments for package and interface integrity characterization
Familiarity with polymer-to-inorganic material adhesion and testing
Experience designing micro-heaters or managing high-heat-flux devices
Background in academic labs known for microsystems (e.g., Stanford SNF/SNSF, MIT MTL, Michigan LNF)
Company
Paradromics
Paradromics is developing high data-rate brain computer interfacing technology
51-200 employees
H1B Sponsorship
Paradromics has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2)
2024 (1)
2023 (3)
2022 (1)
2021 (1)
Funding
Current Stage
Growth StageTotal Funding
$108.64MKey Investors
NEOM Investment FundPrime Movers LabCourt Westcott
2025-12-08Series Unknown· $0.24M
2025-02-12Series Unknown
2024-04-01Secondary Market
Leadership Team
Matt Angle
CEO
Recent News
2025-11-27
2025-11-24
2025-11-23
Company data provided by crunchbase