IBM Fan-Out Wafer Level Packaging Executive Focal Point jobs in United States
cer-icon
Apply on Employer Site
company-logo

IBM · 1 day ago

IBM Fan-Out Wafer Level Packaging Executive Focal Point

positionYorktown Heights, NY
timeFull-time
remoteOnsite
senioritySenior Level

IBM is a leading technology company focused on innovation in computing. They are seeking an Executive Focal Point for Fan-Out Wafer Level Packaging to oversee business development efforts and maintain relationships with ecosystem partners in advanced semiconductor packaging.

Business DevelopmentBusiness Information SystemsCRMData ManagementSoftware
check
Growth Opportunities
check
H1B Sponsor Likelynote

Responsibilities

OWN overall FO-WLP related Business Development efforts
OWN building and maintaining relationships with ecosystem partners
OWN relationship with source IP vendor and develop monetizing plan for foreground IP
OWN foreground IP management
MONITOR closely line and process bring-up
ENSURE bring-up schedules align with Business Development pursuits and overall business plan

Qualification

FO-WLP technologyBusiness DevelopmentProgram ManagementSemiconductor industry experienceComplex multi-organizational managementEngineering degreeSenior level managementC-Suite discussions

Required

BS in engineering or technology related field
Significant experience in semiconductor industry with emphasis on advanced packaging
Experience with FO-WLP technology
Experience in managing complex, multi-organizational situations
Business Development experience in semiconductor packaging
Program Management experience in the semiconductor domain

Preferred

Master's Degree
Deep experience in FO-WLP packaging, particularly as a chips-last format
Graduate degree in engineering
Senior level engineering management experience
Experience navigating C-Suite executive discussions

Company

IBM

twittertwittertwitter
Glassdoor4.1
company-logo
IBM is an IT technology and consulting firm providing computer hardware, software, infrastructure, and hosting services.
dateFounded in 1911
location
Armonk, New York, USA
people-size10001+ employees
web-link
http://www.ibm.com

H1B Sponsorship

IBM has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (3032)
2024 (3301)
2023 (2160)
2022 (1809)
2021 (1157)
2020 (2669)

Funding

Current Stage
Public Company
Total Funding
unknown
2011-01-14IPO

Leadership Team

leader-logo
Alain Bénichou
Chief Executive Officer, IBM Greater China Group
linkedin
leader-logo
Alex Yang
CTO and Chief Architect

Recent News

crnasia.com
IBM: Partners driving modernization for customers in APAC
2026-01-07
The Motley Fool
2 Top Bargain Stocks Ready for Bull Runs
2026-01-06
Finovate
Fintech Rundown: A Rapid Review of Weekly News
2026-01-06
Company data provided by crunchbase