Thermo-Mechanical Packaging Engineer jobs in United States
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Nokia · 1 day ago

Thermo-Mechanical Packaging Engineer

Nokia is a global leader in connectivity for the AI era. The Thermo-Mechanical Packaging Engineer will conduct research and lead the design of thermo-mechanical packages, ensuring optimal thermal performance and troubleshooting issues during product validation.

ElectronicsEnterprise SoftwareInternet of ThingsMobile DevicesTelecommunications
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Culture & Values
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H1B Sponsor Likelynote

Responsibilities

Lead thermo-mechanical package design in collaboration with cross-functional teams and stakeholders to ensure package requirements are met
Optimize thermal performance of optical engines by applying Design for Manufacturing principles to meet production volumes and cost targets
Perform and validate thermal, structural, and performance analysis using ANSYS or similar software
Survey advanced thermal solutions and materials to stay current with new technological advancements
Troubleshoot thermo-mechanical issues during product validation and qualification

Qualification

CFD simulationsDFMEA simulationsThermal management systemsPackage design experienceIndustry Test StandardsMicroelectronics packagingPackaging technologiesHigh-speed electronics designMetrology techniquesInterpersonal skillsCommunication skillsProblem-solving skills

Required

Expertise in CFD and DFMEA simulations using ANSYS or similar software
Deep understanding of thermal management systems and material properties for optoelectronic assembly processes
Industry experience with package and process design/development from design to production
Familiarity with Industry Test Standards, such as JEDEC, EIA, Telcordia, Mil-Std, etc
Solid interpersonal, communication and problem-solving skills to interact with engineering staff, external vendors and contractors effectively

Preferred

Experience in microelectronics, optoelectronics packaging design and assembly
Knowledgeable in packaging technologies and processes, including multilayer materials interfaces and flipchip/BGA/PCBA/Flex design reliability and processing
Understanding of optical epoxies, non-hermetic packaging, and high-volume packaging and thermal analysis of 2.5/ 3D packages
Experience in high-speed electronics package design and/or laser package design
Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience

Benefits

Corporate Retirement Savings Plan
Health and dental benefits
Short-term disability, and long-term disability
Life insurance, and AD&D – Company paid 2x base pay
Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
Paid time off for holidays and Vacation
Employee Stock Purchase Plan
Tuition Assistance Plan
Adoption assistance
Employee Assistance Program/Work Life Resource Program

Company

Nokia manufactures mobile devices, network infrastructure, and location-based technology for businesses. It is a sub-organization of Enscryb.

H1B Sponsorship

Nokia has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (262)
2024 (264)
2023 (259)
2022 (250)
2021 (296)
2020 (287)

Funding

Current Stage
Public Company
Total Funding
$4.45B
Key Investors
European Investment BankNVIDIANational Telecommunications and Information Administration
2025-12-16Post Ipo Debt· $511.84M
2025-10-28Post Ipo Equity· $1B
2025-06-30Post Ipo Debt· $1.76B

Leadership Team

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Justin Hotard
President and CEO
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Victoria Hanrahan
Chief of Staff to the CEO
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Company data provided by crunchbase