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Intel Corporation · 1 day ago

Silicon Packaging Architect / Engineer

US, California, Folsom

Full-time

Onsite

Mid, Senior Level

$122K/yr - $232K/yr

4+ years exp

Intel Corporation is a leader in technology innovation, focusing on creating advanced wireless solutions. The Silicon Packaging Architect/Engineer will drive semiconductor packaging technology for WiFi, Bluetooth, and mmWave products, ensuring performance and reliability through strategic leadership and technical excellence.

Semiconductors

Growth Opportunities

No H1B

Responsibilities

Translate product requirements into comprehensive package architecture specifications

Lead technology trade-off decisions ensuring packages meet electrical, mechanical, thermal, and reliability standards

Define overall product package performance specifications and drive technology certification

Oversee end-to-end package development processes, from design through production

Troubleshoot complex packaging problems and develop innovative, cost-effective solutions

Research packaging assembly materials and properties, establishing specifications for suppliers

Perform mechanical and reliability simulations to optimize package design

Conduct thermal performance simulations using predictive FEA analysis

Partner with silicon, hardware, and package design teams to ensure high-quality deliverables

Coordinate with internal/external manufacturing partners (OSATs) and substrate suppliers

Support product co-design and layout teams as manufacturing liaison

Collaborate with Quality & Reliability teams to ensure products meet specifications

Complete DFMEA assessments with assembly suppliers to evaluate technology risks

Ensure seamless transition from design to high-volume production

Design and validate Test Vehicles for process characterization

Provide consultation on packaging improvements and process optimization

Qualification

Package assembly technologyPackaging physicsManufacturing processesRF Component PackagingTesting systems MatlabTesting systems LabViewMicrosoft Office SuiteAction-oriented mindsetProject managementCommunication skillsProblem-solving

Required

Bachelor's degree in Mechanical Engineering, Electrical Engineering, Materials Science/Engineering, Physics, or related field + 4+ years industry experience OR Master's degree in relevant field + 3+ years experience OR PhD in relevant field + 1+ years experience

2+ years package assembly technology development experience

2+ years packaging physics (mechanical and thermal) and/or materials experience

2+ years package assembly manufacturing processes and HVM ramp experience

Strong project management capabilities

Proficiency in Microsoft Office Suite

Excellent communication and presentation abilities

Self-driven with strong problem-solving tenacity

Action-oriented mindset